| Commit message (Collapse) | Author | Age | Files | Lines | |
|---|---|---|---|---|---|
| * | usb: musb: introduce DA8xx/OMAP-L1x glue layer | Sergei Shtylyov | 2010-10-22 | 1 | -0/+469 |
| Texas Instruments DA8xx/OMAP-L1x glue layer for the MUSBMHRDC driver. Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com> Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com> Signed-off-by: Felipe Balbi <balbi@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de> | |||||
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index : op-kernel-dev | |
| Development kernel branch for OpenPOWER systems | Raptor Engineering, LLC |
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