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* Thermal: Fix DEFAULT_THERMAL_GOVERNORZhang Rui2012-12-121-1/+1
| | | | | | | Fix DEFAULT_THERMAL_GOVERNOR to be consistant with the default governor selected in kernel config file. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: fix a NULL pointer dereference when generic thermal layer is built ↵Zhang Rui2012-12-121-1/+2
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | as a module [ 12.761956] BUG: unable to handle kernel NULL pointer dereference at 0000000000000018 [ 12.762016] IP: [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys] [ 12.762060] PGD 1fec74067 PUD 1fee5b067 PMD 0 [ 12.762127] Oops: 0000 [#1] SMP [ 12.762177] Modules linked in: hid_generic crc32c_intel usbhid hid firewire_ohci(+) e1000e(+) firewire_core crc_itu_t xhci_hcd(+) thermal(+) fan thermal_sys hwmon [ 12.762423] CPU 1 [ 12.762443] Pid: 187, comm: modprobe Tainted: G A 3.7.0-thermal-module+ #25 /DH77DF [ 12.762496] RIP: 0010:[<ffffffffa0005277>] [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys] [ 12.762682] RSP: 0018:ffff8801fe7ddc18 EFLAGS: 00010282 [ 12.762704] RAX: 0000000000000000 RBX: ffff8801ff3e9c00 RCX: ffff8801fdc39800 [ 12.762728] RDX: ffff8801fe7ddc24 RSI: 0000000000000001 RDI: ffff8801ff3e9c00 [ 12.762764] RBP: ffff8801fe7ddc48 R08: 0000000004000000 R09: ffffffffa001f568 [ 12.762797] R10: ffffffff81363083 R11: 0000000000000001 R12: 0000000000000001 [ 12.762832] R13: 0000000000000000 R14: 0000000000000001 R15: ffff8801fde73e68 [ 12.762866] FS: 00007f5548516700(0000) GS:ffff88021f240000(0000) knlGS:0000000000000000 [ 12.762912] CS: 0010 DS: 0000 ES: 0000 CR0: 0000000080050033 [ 12.762946] CR2: 0000000000000018 CR3: 00000001fefe2000 CR4: 00000000001407e0 [ 12.762979] DR0: 0000000000000000 DR1: 0000000000000000 DR2: 0000000000000000 [ 12.763014] DR3: 0000000000000000 DR6: 00000000ffff0ff0 DR7: 0000000000000400 [ 12.763048] Process modprobe (pid: 187, threadinfo ffff8801fe7dc000, task ffff8801fe5bdb40) [ 12.763095] Stack: [ 12.763122] 0000000000019640 00000000fdc39800 ffff8801fe7ddc48 ffff8801ff3e9c00 [ 12.763225] 0000000000000002 0000000000000000 ffff8801fe7ddc78 ffffffffa00053e7 [ 12.763338] ffff8801ff3e9c00 0000000000006c98 ffffffffa0007480 ffff8801ff3e9c00 [ 12.763440] Call Trace: [ 12.763470] [<ffffffffa00053e7>] thermal_zone_device_update+0x77/0xa0 [thermal_sys] [ 12.763515] [<ffffffffa0006d38>] thermal_zone_device_register+0x788/0xa88 [thermal_sys] [ 12.763562] [<ffffffffa001f394>] acpi_thermal_add+0x360/0x4c8 [thermal] [ 12.763598] [<ffffffff8133902a>] acpi_device_probe+0x50/0x190 [ 12.763632] [<ffffffff811bd793>] ? sysfs_create_link+0x13/0x20 [ 12.763666] [<ffffffff813cc41b>] driver_probe_device+0x7b/0x240 [ 12.763699] [<ffffffff813cc68b>] __driver_attach+0xab/0xb0 [ 12.763732] [<ffffffff813cc5e0>] ? driver_probe_device+0x240/0x240 [ 12.763766] [<ffffffff813ca836>] bus_for_each_dev+0x56/0x90 [ 12.763799] [<ffffffff813cbf4e>] driver_attach+0x1e/0x20 [ 12.763831] [<ffffffff813cbac0>] bus_add_driver+0x190/0x290 [ 12.763864] [<ffffffffa0022000>] ? 0xffffffffa0021fff [ 12.763896] [<ffffffff813ccbea>] driver_register+0x7a/0x160 [ 12.763928] [<ffffffffa0022000>] ? 0xffffffffa0021fff [ 12.763960] [<ffffffff813399fb>] acpi_bus_register_driver+0x43/0x45 [ 12.763995] [<ffffffffa002203a>] acpi_thermal_init+0x3a/0x42 [thermal] [ 12.764029] [<ffffffff8100207f>] do_one_initcall+0x3f/0x170 [ 12.764063] [<ffffffff810b1a5f>] sys_init_module+0x8f/0x200 [ 12.764097] [<ffffffff815ff259>] system_call_fastpath+0x16/0x1b [ 12.764129] Code: 48 8b 87 c8 02 00 00 41 89 f4 48 8d 55 dc ff 50 28 44 8b 6d dc 41 8d 45 fe 83 f8 01 76 5e 48 8b 83 d8 02 00 00 44 89 e6 48 89 df <ff> 50 18 4c 8d a3 10 03 00 00 4c 89 e7 e8 87 f1 5e e1 8b 83 bc [ 12.765164] RIP [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys] [ 12.765223] RSP <ffff8801fe7ddc18> [ 12.765252] CR2: 0000000000000018 [ 12.765284] ---[ end trace 7723294cdfb00d2a ]--- This is because thermal_zone_device_update() is invoked before any thermal governors being registered. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: rcar: add rcar_zone_to_priv() macroKuninori Morimoto2012-11-261-1/+2
| | | | | | | | This patch adds rcar_zone_to_priv() which is a helper macro for gettign private data. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: rcar: fixup the unit of temperatureKuninori Morimoto2012-11-261-1/+3
| | | | | | | The unit of temperature is Milli-Celsius. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: cpu cooling: allow module buildsEduardo Valentin2012-11-221-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | As thermal drivers can be built as modules and also the thermal framework itself, building cpu cooling only as built-in can cause linking errors. For instance: * Generic Thermal sysfs driver * Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y with the following drive: CONFIG_OMAP_BANDGAP=m generates: ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! This patch changes cpu cooling driver to allow it to be built as module. Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: cpu cooling: use const parameter while registeringEduardo Valentin2012-11-221-1/+1
| | | | | | | | | | | | | | | | | | | | There are predefined cpu_masks that are const data structures. This patch changes the cpu cooling register function so that those const cpu_masks can be used, without compilation warnings. include/linux/cpumask.h * The following particular system cpumasks and operations manage * possible, present, active and online cpus. * * cpu_possible_mask- has bit 'cpu' set iff cpu is populatable * cpu_present_mask - has bit 'cpu' set iff cpu is populated * cpu_online_mask - has bit 'cpu' set iff cpu available to scheduler * cpu_active_mask - has bit 'cpu' set iff cpu available to migration * Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add ST-Ericsson DB8500 thermal driver.hongbo.zhang2012-11-154-0/+661
| | | | | | | | | | | | | | This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* drivers/thermal/Makefile refactorZhang Rui2012-11-151-6/+12
| | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Exynos: Add missing dependencyZhang Rui2012-11-151-1/+1
| | | | | | | | | | | CPU_FREQ_TABLE depends on CPU_FREQ. Selecting CPU_FREQ_TABLE without checking for dependencies gives the following compilation warnings: warning: (ARCH_TEGRA_2x_SOC && ARCH_TEGRA_3x_SOC && UX500_SOC_DB8500 && CPU_THERMAL && EXYNOS_THERMAL) selects CPU_FREQ_TABLE which has unmet direct dependencies (ARCH_HAS_CPUFREQ && CPU_FREQ) Based-on-patch-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Refactor drivers/thermal/KconfigZhang Rui2012-11-151-52/+51
| | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: cpu_cooling: Make 'notify_device' staticSachin Kamat2012-11-151-1/+1
| | | | | | | | | | Silences the following sparse warning: drivers/thermal/cpu_cooling.c:67:31: warning: symbol 'notify_device' was not declared. Should it be static? Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Remove the cooling_cpufreq_list.hongbo.zhang2012-11-071-72/+19
| | | | | | | | | | | | | Problem of using this list is that the cpufreq_get_max_state callback will be called when register cooling device by thermal_cooling_device_register, but this list isn't ready at this moment. What's more, there is no need to maintain such a list, we can get cpufreq_cooling_device instance by the private thermal_cooling_device.devdata. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: fix bug of counting cpu frequencies.hongbo.zhang2012-11-071-4/+6
| | | | | | | | | | | | In the while loop for counting cpu frequencies, if table[i].frequency equals CPUFREQ_ENTRY_INVALID, index i won't be increased, so this leads to an endless loop, what's more the index i cannot be referred as cpu frequencies number if there is CPUFREQ_ENTRY_INVALID case. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: add indent for code alignment.hongbo.zhang2012-11-071-1/+1
| | | | | | | | The curly bracket should be aligned with corresponding if else statements. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: rcar_thermal: remove explicitly used devm_kfree/iounap()Kuninori Morimoto2012-11-071-16/+2
| | | | | | | devm_kfree and devm_iounmap should not have to be explicitly used Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: user_space: Add missing static storage class specifiersSachin Kamat2012-11-051-2/+2
| | | | | | | | | | | | Fixes the following sparse warnings: drivers/thermal/user_space.c:38:5: warning: symbol 'notify_user_space' was not declared. Should it be static? drivers/thermal/user_space.c:46:25: warning: symbol 'thermal_gov_user_space' was not declared. Should it be static? Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: fair_share: Add missing static storage class specifiersSachin Kamat2012-11-051-2/+2
| | | | | | | | | | | | Fixes the following sparse warnings: drivers/thermal/fair_share.c:80:5: warning: symbol 'fair_share_throttle' was not declared. Should it be static? drivers/thermal/fair_share.c:111:25: warning: symbol 'thermal_gov_fair_share' was not declared. Should it be static? Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: step_wise: Add missing static storage class specifiersSachin Kamat2012-11-051-2/+2
| | | | | | | | | | | | Fixes the following sparse warnings: drivers/thermal/step_wise.c:153:5: warning: symbol 'step_wise_throttle' was not declared. Should it be static? drivers/thermal/step_wise.c:172:25: warning: symbol 'thermal_gov_step_wise' was not declared. Should it be static? Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Fix oops and unlocking in thermal_sys.cHugh Dickins2012-11-051-4/+5
| | | | | | | | | | | | | | | | | | | This patch fixes the following mutex and NULL pointer problems in thermal_sys.c: * mutex_unlock fix in update_temperature function * mutex_unlock fix in bind_cdev function * Correct early return to continue in bind_cdev function * NULL check fix in bind_cdev function * NULL check fix in bind_tz function Reported-by: Dan Carpenter <dan.carpenter@oracle.com> Reported-by: Sedat Dilek <sedat.dilek@gmail.com> Reported-by: Hugh Dickins <hughd@google.com> Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Sedat Dilek <sedat.dilek@gmail.com> Signed-off-by: Hugh Dickins <hughd@google.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Provide option to choose default thermal governorDurgadoss R2012-11-051-0/+31
| | | | | | | | | This patch provides option to choose the default thermal governor. If no option is provided, the step_wise governor is selected by default. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add a notification APIDurgadoss R2012-11-051-0/+18
| | | | | | | | | This patch adds a notification API which the sensor drivers' can use to notify the framework. The framework then takes care of the throttling according to the configured policy. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Remove throttling logic out of thermal_sys.cDurgadoss R2012-11-051-198/+109
| | | | | | | | | | | | | | This patch removes the throttling logic out of thermal_sys.c; also refactors the code into smaller functions so that are easy to read/maintain. * Seperates the handling of critical and non-critical trips * Re-arranges the set_polling and device_check methods, so that all related functions are arranged in one place. * Removes the 'do_update' and 'trip_update' method, as part of moving the throttling logic out of thermal_sys.c Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add a thermal notifier for user spaceDurgadoss R2012-11-053-0/+75
| | | | | | | | | | This patch registers a governor which will let the user land manage the platform thermals. Whenever a trip happens, this governor just notifies the user space using kobj_uevent(). Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Introduce a step_wise thermal governorDurgadoss R2012-11-053-0/+201
| | | | | | | | | | | | | | This patch adds a simple step_wise governor to the generic thermal layer. This algorithm throttles the cooling devices in a linear fashion. If the 'trend' is heating, it throttles by one step. And if the thermal trend is cooling it de-throttles by one step. This actually moves the throttling logic from thermal_sys.c and puts inside step_wise.c, without any change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Introduce fair_share thermal governorDurgadoss R2012-11-053-0/+140
| | | | | | | | | | | | | | | This patch introduces a simple 'weight' based governor named fair_share governor. Whenever the thermal framework gets notified of the trip point violation, this governor (if configured), throttles the cooling devices associated with a thermal zone. This mapping between a thermal zone and a cooling device and the effectiveness of cooling are provided in the platform layer. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Make thermal_cdev_update as a global functionDurgadoss R2012-11-051-2/+3
| | | | | | | | | | This patch makes the thermal_cdev_update function as a global one, so that other files can use it. This function serves as a single arbitrator to set the state of a cooling device. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Update binding logic based on platform dataDurgadoss R2012-11-051-26/+157
| | | | | | | | | | | | | | | | | This patch updates the binding logic in thermal_sys.c It uses the platform layer data to bind a thermal zone to a cdev for a particular trip point. * If we do not have platform data and do not have .bind defined, do not bind. * If we do not have platform data but .bind is defined, then use tz->ops->bind. * If we have platform data, use it to create binding. The same logic sequence is followed for unbind also. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add a policy sysfs attributeDurgadoss R2012-11-051-3/+39
| | | | | | | | | This patch adds a policy sysfs attribute to a thermal zone. This attribute denotes the throttling governor used for the zone. This is a RW attribute. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add thermal governor registration APIsDurgadoss R2012-11-051-0/+90
| | | | | | | | | | This patch creates a structure to hold platform thermal governor information, and provides APIs for individual thermal governors to register/unregister with the Thermal framework. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Pass zone parameters as argument to tzd_registerDurgadoss R2012-11-054-3/+6
| | | | | | | | | This patch adds the thermal zone parameter as an argument to the tzd_register() function call; and updates other drivers using this function. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add get trend, get instance API's to thermal_sysDurgadoss R2012-11-051-0/+40
| | | | | | | | | | | This patch adds the following API's to thermal_sys.c, that can be used by other Thermal drivers. * get_tz_trend: obtain the trend of the given thermal zone * get_thermal_instance: obtain the instance corresponding to the given tz, cdev and the trip point. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Move thermal_instance to thermal_core.hDurgadoss R2012-11-052-21/+55
| | | | | | | | | | This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* exynos4_tmu_driver_ids should be exynos_tmu_driver_ids.Jonghwan Choi2012-11-031-1/+1
| | | | | | Signed-off-by: Jonghwan Choi <jhbird.choi@samsung.com> Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: solve compilation errors in rcar_thermalDevendra Naga2012-11-031-1/+1
| | | | | | | | | | | | | | | | | | following were the errors reported drivers/thermal/rcar_thermal.c: In function ‘rcar_thermal_probe’: drivers/thermal/rcar_thermal.c:214:10: warning: passing argument 3 of ‘thermal_zone_device_register’ makes integer from pointer without a cast [enabled by default] include/linux/thermal.h:166:29: note: expected ‘int’ but argument is of type ‘struct rcar_thermal_priv *’ drivers/thermal/rcar_thermal.c:214:10: error: too few arguments to function ‘thermal_zone_device_register’ include/linux/thermal.h:166:29: note: declared here make[1]: *** [drivers/thermal/rcar_thermal.o] Error 1 make: *** [drivers/thermal/rcar_thermal.o] Error 2 with gcc version 4.6.3 (Ubuntu/Linaro 4.6.3-1ubuntu5) Signed-off-by: Devendra Naga <develkernel412222@gmail.com> Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configuredDavid Rientjes2012-10-151-0/+2
| | | | | | | | | | | | | | | | | | | | Commit 023614183768 ("thermal: add generic cpufreq cooling implementation") requires cpufreq_frequency_get_table(), but that function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the following build error: drivers/built-in.o: In function `cpufreq_get_max_state': drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table' drivers/built-in.o: In function `get_cpu_frequency': drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table' Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration. It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so select it there as well. Signed-off-by: David Rientjes <rientjes@google.com> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
* Merge branch 'release' of ↵Len Brown2012-10-097-123/+1937
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal Conflicts: drivers/staging/omap-thermal/omap-thermal-common. OMAP supplied dummy TC1 and TC2, at the same time that the thermal tree removed them from thermal_zone_device_register() drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c propogate the upstream MAX_IDR_LEVEL re-name to prevent a build failure Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Len Brown <len.brown@intel.com>
| * thermal: Exynos: Fix NULL pointer dereference in exynos_unregister_thermal()Sachin Kamat2012-09-281-2/+5
| | | | | | | | | | | | | | | | exynos_unregister_thermal() is functional only when 'th_zone' is not NULL (ensured by the NULL checks). However, in the event it is NULL, it gets dereferenced in the for loop. This patch fixes this issue. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
| * Thermal: Fix bug on cpu_cooling, cooling device's id conflict problem.Jonghwa Lee2012-09-271-2/+1
| | | | | | | | | | | | | | | | | | This patch fixes small bug on cpu_cooling. CPU cooling device has own id generated with idr mathod. However in the previous version, it swapped to all same id at last stage of probing as 0. This makes id's collision and also occures error when it releases that id. Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
| * thermal: exynos: Use devm_* functionsAmit Daniel Kachhap2012-09-241-36/+9
| | | | | | | | | | | | | | | | | | | | | | devm_* functions are used to replace kzalloc, request_mem_region, ioremap and request_irq functions in probe call. With the usage of devm_* functions explicit freeing and unmapping is not required. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Sachin Kamat <sachin.kamat@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * ARM: exynos: add thermal sensor driver platform data supportAmit Daniel Kachhap2012-09-241-1/+110
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add necessary default platform data support needed for TMU driver. The supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250 platforms and only compile tested for exynos4412. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: jonghwa lee <jonghwa3.lee@samsung.com> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: exynos: register the tmu sensor with the kernel thermal layerAmit Daniel Kachhap2012-09-241-2/+404
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This code added creates a link between temperature sensors, linux thermal framework and cooling devices for samsung exynos platform. This layer monitors the temperature from the sensor and informs the generic thermal layer to take the necessary cooling action. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: exynos5: add exynos5250 thermal sensor driver supportAmit Daniel Kachhap2012-09-242-128/+225
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4 changes are made generic for exynos series. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: SangWook Ju <sw.ju@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * hwmon: exynos4: move thermal sensor driver to driver/thermal directoryAmit Daniel Kachhap2012-09-243-0/+421
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: add generic cpufreq cooling implementationAmit Daniel Kachhap2012-09-243-0/+462
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: Fix potential NULL pointer accessesGuenter Roeck2012-09-241-4/+4
| | | | | | | | | | | | | | | | | | | | | | | | The type parameter in thermal_zone_device_register and thermal_cooling_device_register can be NULL, indicating that no sysfs attribute for the type should be created. Only call strlen() and strcpy() on type if it is not NULL. This patch addresses Coverity #102180 and #102182: Dereference before null check Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: add Renesas R-Car thermal sensor supportKuninori Morimoto2012-09-243-1/+270
| | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: fix potential out-of-bounds memory accessGuenter Roeck2012-09-241-2/+3
| | | | | | | | | | | | | | | | | | | | | | | | | | | | temp_crit.name and temp_input.name have a length of 16 bytes. Using THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in out-of-bounds memory accesses. Replace it with sizeof(). Addresses Coverity #115679 Signed-off-by: Guenter Roeck <linux@roeck-us.net> Cc: Len Brown <lenb@kernel.org> Cc: "Brown, Len" <len.brown@intel.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * Thermal: Introduce locking for cdev.thermal_instances list.Zhang Rui2012-09-241-0/+8
| | | | | | | | | | | | | | | | | | | | | | | | | | we need to go over all the thermal_instance list of a cooling device to decide which cooling state to put the cooling device to. But at this time, as a cooling device may be referenced in multiple thermal zones, we need to lock the list first in case another thermal zone is updating this cooling device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Unify the code for both active and passive coolingZhang Rui2012-09-241-85/+25
| | | | | | | | | | | | | | | | | | | | Remove thermal_zone_device_passive(). And use thermal_zone_trip_update() and thermal_zone_do_update() for both active and passive cooling. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Introduce simple arbitrator for setting device cooling stateZhang Rui2012-09-241-3/+41
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This fixes the problem that a cooling device may be referenced by by multiple trip points in multiple thermal zones. With this patch, we have two stages for updating a thermal zone, 1. check if a thermal_instance needs to be updated or not 2. update the cooling device, based on the target cooling state of all its instances. Note that, currently, the cooling device is set to the deepest cooling state required. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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