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path: root/drivers/thermal/db8500_thermal.c
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* thermal: db8500: Fix module autoloadJavier Martinez Canillas2016-11-231-0/+1
| | | | | | | | | | | | | | | | | | | | | | If the driver is built as a module, autoload won't work because the module alias information is not filled. So user-space can't match the registered device with the corresponding module. Export the module alias information using the MODULE_DEVICE_TABLE() macro. Before this patch: $ modinfo drivers/thermal/db8500_thermal.ko | grep alias $ After this patch: $ modinfo drivers/thermal/db8500_thermal.ko | grep alias alias: of:N*T*Cstericsson,db8500-thermalC* alias: of:N*T*Cstericsson,db8500-thermal Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Enhance thermal_zone_device_update for eventsSrinivas Pandruvada2016-09-271-1/+1
| | | | | | | | | | | | | | | | | | Added one additional parameter to thermal_zone_device_update() to provide caller with an optional capability to specify reason. Currently this event is used by user space governor to trigger different processing based on event code. Also it saves an additional call to read temperature when the event is received. The following events are cuurently defined: - Unspecified event - New temperature sample - Trip point violated - Trip point changed - thermal device up and down - thermal device power capability changed Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: consistently use int for temperaturesSascha Hauer2015-08-031-4/+3
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The thermal code uses int, long and unsigned long for temperatures in different places. Using an unsigned type limits the thermal framework to positive temperatures without need. Also several drivers currently will report temperatures near UINT_MAX for temperatures below 0°C. This will probably immediately shut the machine down due to overtemperature if started below 0°C. 'long' is 64bit on several architectures. This is not needed since INT_MAX °mC is above the melting point of all known materials. Consistently use a plain 'int' for temperatures throughout the thermal code and the drivers. This only changes the places in the drivers where the temperature is passed around as pointer, when drivers internally use another type this is not changed. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Jean Delvare <jdelvare@suse.de> Reviewed-by: Lukasz Majewski <l.majewski@samsung.com> Reviewed-by: Darren Hart <dvhart@linux.intel.com> Reviewed-by: Heiko Stuebner <heiko@sntech.de> Reviewed-by: Peter Feuerer <peter@piie.net> Cc: Punit Agrawal <punit.agrawal@arm.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: Jean Delvare <jdelvare@suse.de> Cc: Peter Feuerer <peter@piie.net> Cc: Heiko Stuebner <heiko@sntech.de> Cc: Lukasz Majewski <l.majewski@samsung.com> Cc: Stephen Warren <swarren@wwwdotorg.org> Cc: Thierry Reding <thierry.reding@gmail.com> Cc: linux-acpi@vger.kernel.org Cc: platform-driver-x86@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-omap@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: Guenter Roeck <linux@roeck-us.net> Cc: Rafael J. Wysocki <rjw@rjwysocki.net> Cc: Maxime Ripard <maxime.ripard@free-electrons.com> Cc: Darren Hart <dvhart@infradead.org> Cc: lm-sensors@lm-sensors.org Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: of: fix cooling device weights in device treeKapileshwar Singh2015-05-041-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: drop owner assignment from platform_driversWolfram Sang2014-10-201-1/+0
| | | | | | | A platform_driver does not need to set an owner, it will be populated by the driver core. Signed-off-by: Wolfram Sang <wsa@the-dreams.de>
* thermal: db8500: Fix missing mutex_unlock() in probe error pathsAxel Lin2013-03-261-6/+11
| | | | | Signed-off-by: Axel Lin <axel.lin@ingics.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: db8500: Fix checking return value of thermal_zone_device_registerAxel Lin2013-03-261-1/+1
| | | | | | | | thermal_zone_device_register() returns ERR_PTR on error, thus use IS_ERR rather than IS_ERR_OR_NULL to check return value. Signed-off-by: Axel Lin <axel.lin@ingics.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: db8500: Use of_match_ptr() macro in db8500_thermal.cSachin Kamat2013-01-041-3/+1
| | | | | | | | | This eliminates having an #ifdef returning NULL for the case when OF is disabled. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Reviewed-by: Hongbo Zhang <hongbo.zhang@stericsson.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add ST-Ericsson DB8500 thermal driver.hongbo.zhang2012-11-151-0/+531
This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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