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* thermal: Add Intel PCH thermal driverTushar Dave2015-08-041-0/+8
| | | | | | | | | | This change adds a thermal driver for Wildcat Point platform controller hub. This driver register PCH thermal sensor as a thermal zone and associate critical and hot trips if present. Signed-off-by: Tushar Dave <tushar.n.dave@intel.com> Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Merge branches 'release' and 'thermal-soc' of .git into nextZhang Rui2015-06-111-0/+44
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| * thermal: hisilicon: add new hisilicon thermal sensor driverkongxinwei2015-06-031-0/+8
| | | | | | | | | | | | | | | | | | | | This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: remove stale THERMAL_POWER_ACTOR selectJavi Merino2015-05-041-1/+0
| | | | | | | | | | | | | | | | | | | | | | A previous version of this patch had a config for THERMAL_POWER_ACTOR but it was dropped. Remove the select as it is not doing anything. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Reported-by: Valentin Rothberg <valentinrothberg@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: core: Add Kconfig option to enable writable tripsPunit Agrawal2015-05-041-0/+11
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add a Kconfig option to allow system integrators to control whether userspace tools can change trip temperatures. This option overrides the thermal zone setup in the driver code and must be enabled for platform specified writable trips to come into effect. The original behaviour of requiring root privileges to change trip temperatures remains unchanged. Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: introduce the Power Allocator governorJavi Merino2015-05-041-0/+15
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: Add QPNP PMIC temperature alarm driverIvan T. Ivanov2015-05-041-0/+11
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add support for the temperature alarm peripheral found inside Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm peripheral outputs a pulse on an interrupt line whenever the thermal over temperature stage value changes. Register a thermal sensor. The temperature reported by this thermal sensor device should reflect the actual PMIC die temperature if an ADC is present on the given PMIC. If no ADC is present, then the reported temperature should be estimated from the over temperature stage value. Cc: David Collins <collinsd@codeaurora.org> Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: intel Quark SoC X1000 DTS thermal driverOng, Boon Leong2015-05-011-0/+10
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS). The DTS offers both hot & critical trip points. However, in current distribution of UEFI BIOS for Quark platform, only critical trip point is configured to be 105 degree Celsius (based on Quark SW ver1.0.1 and hot trip point is not used due to lack of IRQ. There is no active cooling device for Quark SoC, so Quark SoC thermal management logic expects Linux distro to orderly power-off when temperature of the DTS exceeds the configured critical trip point. Kernel param "polling_delay" in milliseconds is used to control the frequency the DTS temperature is read by thermal framework. It defaults to 2-second. To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X". User interacts with Quark SoC DTS thermal driver through sysfs via: /sys/class/thermal/thermal_zone0/ For example: - to read DTS temperature $ cat temp - to read critical trip point $ cat trip_point_0_temp - to read trip point type $ cat trip_point_0_type - to emulate temperature raise to test orderly shutdown by Linux distro $ echo 105 > emul_temp Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie> Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com> Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie> Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Thermal/int340x/processor_thermal: Enable auxiliary DTS for BraswellSrinivas Pandruvada2015-05-011-0/+1
| | | | | | | | | | | | | | | | Support two auxiliary DTS present on Braswell platform using side band IOSF interface. This supports two read write trips, which can be used to get notification on trip violation. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
* | Thermal: Intel SoC: DTS thermal use common APIsSrinivas Pandruvada2015-05-011-1/+2
| | | | | | | | | | | | | | | | | | | | There is no change in functionality but using the common IOSF core APIs. This driver is now just responsible for enumeration and call relevant API to create thermal zone and register critical trip. Also cpuid 0x4c is now handled in the int340x processor thermal driver with the same functionality. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
* | Thermal: Intel SoC: DTS thermal IOSF coreSrinivas Pandruvada2015-05-011-0/+10
|/ | | | | | | | | | | This is becoming a common feature for Intel SoCs to expose the additional digital temperature sensors (DTSs) using side band interface (IOSF). This change remove common IOSF DTS handler function from the existing driver intel_soc_dts_thermal.c and creates a stand alone module, which can be selected from the SoC specific drivers. In this way there is less code duplication. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
* thermal: rockchip: add driver for thermalCaesar Wang2014-11-241-0/+10
| | | | | | | | | | | | | | | | | | | | Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Add Tegra SOCTHERM thermal management driverMikko Perttunen2014-11-201-0/+10
| | | | | | | | | This adds support for the Tegra SOCTHERM thermal sensing and management system found in the Tegra124 system-on-chip. This initial driver supports temperature polling for four thermal zones. Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: introduce clock cooling deviceEduardo Valentin2014-11-201-0/+12
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Merge branch 'next' of ↵Linus Torvalds2014-10-241-15/+34
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "Sorry that I missed the merge window as there is a bug found in the last minute, and I have to fix it and wait for the code to be tested in linux-next tree for a few days. Now the buggy patch has been dropped entirely from my next branch. Thus I hope those changes can still be merged in 3.18-rc2 as most of them are platform thermal driver changes. Specifics: - introduce ACPI INT340X thermal drivers. Newer laptops and tablets may have thermal sensors and other devices with thermal control capabilities that are exposed for the OS to use via the ACPI INT340x device objects. Several drivers are introduced to expose the temperature information and cooling ability from these objects to user-space via the normal thermal framework. From: Lu Aaron, Lan Tianyu, Jacob Pan and Zhang Rui. - introduce a new thermal governor, which just uses a hysteresis to switch abruptly on/off a cooling device. This governor can be used to control certain fan devices that can not be throttled but just switched on or off. From: Peter Feuerer. - introduce support for some new thermal interrupt functions on i.MX6SX, in IMX thermal driver. From: Anson, Huang. - introduce tracing support on thermal framework. From: Punit Agrawal. - small fixes in OF thermal and thermal step_wise governor" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits) Thermal: int340x thermal: select ACPI fan driver Thermal: int3400_thermal: use acpi_thermal_rel parsing APIs Thermal: int340x_thermal: expose acpi thermal relationship tables Thermal: introduce int3403 thermal driver Thermal: introduce INT3402 thermal driver Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.h ACPI / Fan: support INT3404 thermal device ACPI / Fan: add ACPI 4.0 style fan support ACPI / fan: convert to platform driver ACPI / fan: use acpi_device_xxx_power instead of acpi_bus equivelant ACPI / fan: remove no need check for device pointer ACPI / fan: remove unused macro Thermal: int3400 thermal: register to thermal framework Thermal: int3400 thermal: add capability to detect supporting UUIDs Thermal: introduce int3400 thermal driver ACPI: add ACPI_TYPE_LOCAL_REFERENCE support to acpi_extract_package() ACPI: make acpi_create_platform_device() an external API thermal: step_wise: fix: Prevent from binary overflow when trend is dropping ACPI: introduce ACPI int340x thermal scan handler thermal: Added Bang-bang thermal governor ...
| * Merge branch 'int340x-thermal' of .git into nextZhang Rui2014-10-171-15/+24
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| | * Thermal: int340x thermal: select ACPI fan driverZhang Rui2014-10-171-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | we share the same driver for both ACPI predefined Fan device and INT3404 Fan device, thus we should select the ACPI Fan driver when int340x thermal drivers are enabeld. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| | * Thermal: int340x_thermal: expose acpi thermal relationship tablesJacob Pan2014-10-111-0/+5
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | ACPI 4.0 introduced two thermal relationship tables via _ART (active cooling) and _TRT (passive cooling) objects. These tables contain many to many relationships among thermal sensors and cooling devices. This patch parses _ART and _TRT and makes the result available to the userspace via an misc device interface. At the same time, kernel drivers can also request parsing results from internal kernel APIs. The results include source and target devices, influence, and sampling rate in case of _TRT. For _ART, the result shows source device, target device, and weight percentage. Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| | * Thermal: introduce int3403 thermal driverLan Tianyu2014-10-111-15/+0
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | ACPI INT3403 device object can be used to retrieve temperature date from temperature sensors present in the system, and to expose device' performance control. The previous INT3403 thermal driver supports temperature reporting only, thus remove it and introduce this new & enhanced one. Signed-off-by: Lan Tianyu <tianyu.lan@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| | * Thermal: int3400 thermal: register to thermal frameworkZhang Rui2014-10-101-0/+1
| | | | | | | | | | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| | * Thermal: introduce int3400 thermal driverZhang Rui2014-10-101-1/+1
| | | | | | | | | | | | | | | | | | | | | Introduce int3400 thermal driver. And make INT3400 driver enumerate the other int340x thermal components shown in _ART/_TRT. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| | * ACPI: introduce ACPI int340x thermal scan handlerZhang Rui2014-09-111-0/+17
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Newer laptops and tablets that use ACPI may have thermal sensors and other devices with thermal control capabilities outside the core CPU/SOC, for thermal safety reasons. They are exposed for the OS to use via 1) INT3400 ACPI device object as the master. 2) INT3401 ~ INT340B ACPI device objects as the slaves. This patch introduces a scan handler to enumerate the INT3400 ACPI device object to platform bus, and prevent its slaves from being enumerated before the controller driver being probed. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * | thermal: Added Bang-bang thermal governorPeter Feuerer2014-08-271-0/+10
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The bang-bang thermal governor uses a hysteresis to switch abruptly on or off a cooling device. It is intended to control fans, which can not be throttled but just switched on or off. Bang-bang cannot be set as default governor as it is intended for special devices only. For those special devices the driver needs to explicitely request it. Cc: Andrew Morton <akpm@linux-foundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Andreas Mohr <andi@lisas.de> Cc: Borislav Petkov <bp@suse.de> Cc: Javi Merino <javi.merino@arm.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Peter Feuerer <peter@piie.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: Remove ARCH_KIRKWOOD dependencyAndrew Lunn2014-09-091-1/+1
|/ | | | | | | | | | | | | mach-kirkwood has been removed, now that kirkwood lives in mach-mvebu. Depend on MACH_KIRKWOOD, which will be set when kirkwood is built as part of ARCH_MVEBU. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Acked-by: Eduardo Valentin <edubezval@gmail.com> Link: https://lkml.kernel.org/r/1409417172-6846-4-git-send-email-andrew@lunn.ch Signed-off-by: Jason Cooper <jason@lakedaemon.net>
*-. Merge branches 'exynos-fix', 'for-rc', 'int3403-fix', 'misc', 'rcar-thermal' ↵Zhang Rui2014-07-221-1/+6
|\ \ | | | | | | | | | and 'sti-thermal' of .git into next
| | * thermal: sti: Introduce ST Thermal core codeLee Jones2014-07-151-0/+5
| |/ |/| | | | | | | | | | | | | | | | | This core is shared by both ST's 'memory mapped' and 'system configuration register' based Thermal controllers. Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com> Signed-off-by: Lee Jones <lee.jones@linaro.org> Acked-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: allow building dove_thermal with mvebuRiku Voipio2014-07-151-1/+1
|/ | | | | | | | | | | | | | | | | | | | | | | | DT-enabled Dove has moved from ARCH_DOVE in mach-dove to MACH_DOVE in mach-mvebu. As non-DT ARCH_DOVE will stay to rot for a while, add a new DT-only MACH_DOVE to thermal Kconfig. This was originally supposed to go in via "ARM: dove: prepare new Dove DT Kconfig" patch from Sebastian Hesselbarth for 3.15, but slipped through the cracks. I've tested on CuBox that without this patch you can't compile dove_thermal into a mach-mvebu based kernel, and with this patch I can build the driver and it works as expected run-time. v2: non-ascii char creeped in somehow Signed-off-by: Riku Voipio <riku.voipio@linaro.org> Cc: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Acked-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
*-. Merge branches 'armada-375-380-soc-support', 'eduardo-thermal-soc-fixes', ↵Zhang Rui2014-05-151-1/+13
|\ \ | | | | | | | | | 'intel-soc-dts-thermal' and 'thermal-soc-fixes' of .git into next
| | * thermal: Intel SoC DTS thermalSrinivas Pandruvada2014-05-151-0/+12
| |/ |/| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | In the Intel SoCs like Bay Trail, there are 2 additional digital temperature sensors(DTS), in addition to the standard DTSs in the core. Also they support 4 programmable thresholds, out of which two can be used by OSPM. These thresholds can be used by OSPM thermal control. Out of these two thresholds, one is used by driver and one user mode can change via thermal sysfs to get notifications on threshold violations. The driver defines one critical trip points, which is set to TJ MAX - offset. The offset can be changed via module parameter (default 5C). Also it uses one of the thresholds to get notification for this temperature violation. This is very important for orderly shutdown as the many of these devices don't have ACPI thermal zone, and expects that there is some other thermal control mechanism present in OSPM. When a Linux distro is used without additional specialized thermal control program, BIOS can do force shutdown when thermals are not under control. When temperature reaches critical, the Linux thermal core will initiate an orderly shutdown. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * Merge branch 'next' of ↵Zhang Rui2014-05-151-1/+1
| |\ |/ / | | | | git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc-fixes
| * thermal: offer Samsung thermal support only when ARCH_EXYNOS is definedBartlomiej Zolnierkiewicz2014-05-061-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | Menu for Samsung thermal support is visible on all Samsung platforms while thermal drivers are currently available only for EXYNOS SoCs. Fix it by replacing PLAT_SAMSUNG dependency with ARCH_EXYNOS one. Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | Merge tag 'drivers-3.15' of ↵Linus Torvalds2014-04-051-1/+1
|\ \ | |/ |/| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc Pull ARM SoC driver changes from Arnd Bergmann: "These changes are mostly for ARM specific device drivers that either don't have an upstream maintainer, or that had the maintainer ask us to pick up the changes to avoid conflicts. A large chunk of this are clock drivers (bcm281xx, exynos, versatile, shmobile), aside from that, reset controllers for STi as well as a large rework of the Marvell Orion/EBU watchdog driver are notable" * tag 'drivers-3.15' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (99 commits) Revert "dts: socfpga: Add DTS entry for adding the stmmac glue layer for stmmac." Revert "net: stmmac: Add SOCFPGA glue driver" ARM: shmobile: r8a7791: Fix SCIFA3-5 clocks ARM: STi: Add reset controller support to mach-sti Kconfig drivers: reset: stih416: add softreset controller drivers: reset: stih415: add softreset controller drivers: reset: Reset controller driver for STiH416 drivers: reset: Reset controller driver for STiH415 drivers: reset: STi SoC system configuration reset controller support dts: socfpga: Add sysmgr node so the gmac can use to reference dts: socfpga: Add support for SD/MMC on the SOCFPGA platform reset: Add optional resets and stubs ARM: shmobile: r7s72100: fix bus clock calculation Power: Reset: Generalize qnap-poweroff to work on Synology devices. dts: socfpga: Update clock entry to support multiple parents ARM: socfpga: Update socfpga_defconfig dts: socfpga: Add DTS entry for adding the stmmac glue layer for stmmac. net: stmmac: Add SOCFPGA glue driver watchdog: orion_wdt: Use %pa to print 'phys_addr_t' drivers: cci: Export CCI PMU revision ...
| * drivers: Enable building of Kirkwood drivers for mach-mvebuAndrew Lunn2014-02-241-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | With the move of kirkwood into mach-mvebu, drivers Kconfig need tweeking to allow the kirkwood specific drivers to be built. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Acked-by: Arnd Bergmann <arnd@arndb.de> Acked-by: Mark Brown <broonie@linaro.org> Acked-by: Kishon Vijay Abraham I <kishon@ti.com> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Tested-by: Jason Gunthorpe <jgunthorpe@obsidianresearch.com> Cc: Viresh Kumar <viresh.kumar@linaro.org> Cc: Rafael J. Wysocki <rjw@rjwysocki.net> Cc: Richard Purdie <rpurdie@rpsys.net> Cc: Bryan Wu <cooloney@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Jason Cooper <jason@lakedaemon.net>
* | thermal,rcar_thermal: Add dependency on HAS_IOMEMRichard Weinberger2014-03-031-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST) broke build on archs wihout io memory. On archs like S390 or um this driver cannot build nor work. Make it depend on HAS_IOMEM to bypass build failures. drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource' drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource' Signed-off-by: Richard Weinberger <richard@nod.at> Acked-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com> Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Thermal: update INT3404 thermal driver help textZhang Rui2014-03-031-2/+10
|/ | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com>
*---. Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git ↵Zhang Rui2014-01-021-1/+22
|\ \ \ | | | | | | | | | | | | into next
| | | * Thermal: ACPI INT3403 thermal driverSrinivas Pandruvada2014-01-021-0/+7
| |_|/ |/| | | | | | | | | | | | | | | | | | | | | | | | | | The ACPI INT3403 device objects present on some systems can be used to retrieve temperature data from thermal sensors. Add a driver registering each INT3403 device object as a thermal zone device and exposing its _TMP, PATx and GTSH method via the standard thermal control interface under /sys/class/thermal/. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| | * thermal: cpu_cooling: introduce of_cpufreq_cooling_registerEduardo Valentin2013-12-041-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces an API to register cpufreq cooling device based on device tree node. The registration via device tree node differs from normal registration due to the fact that it is needed to fill the device_node structure in order to be able to match the cooling devices with trip points. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
| | * thermal: introduce device tree parserEduardo Valentin2013-12-041-0/+13
| |/ |/| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * thermal: rcar-thermal: Enable driver compilation with COMPILE_TESTLaurent Pinchart2014-01-021-1/+1
|/ | | | | | | | | | | | This helps increasing build testing coverage. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com> Acked-by: Simon Horman <horms@verge.net.au> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Merge branch 'next' of ↵Linus Torvalds2013-11-141-3/+4
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "This time we only have a few changes as there are no soc thermal changes from Eduardo. The only big change is the introduction of TMON, a tool to help visualize, tune, and test the thermal subsystem. The rest is mostly cleanups and fixes all over. Specifics: - introduce TMON, a tool base on thermal sysfs I/F. It can be used to visualize, tune and test the thermal subsystem. - fix a zone/cooling device binding problem, when both thermal zone bind parameters and .bind() callback are available" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: tools/thermal: Introduce tmon, a tool for thermal subsystem thermal: Fix binding problem when there is thermal zone params thermal: cpu_cooling: fix return value check in cpufreq_cooling_register() Thermal: Check for validity before doing kfree thermal/intel_powerclamp: Add newer CPU models Thermal: Tidy up error handling in powerclamp_init thermal: Kconfig: cosmetic fixes ACPI/thermal : Remove zone disabled warning typo in drivers/thermal/Kconfig: lpatform instead of platform
| * thermal: Kconfig: cosmetic fixesLuka Perkov2013-10-091-2/+3
| | | | | | | | | | | | | | | | | | Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * typo in drivers/thermal/Kconfig: lpatform instead of platformRegid Ichira2013-09-251-1/+1
| | | | | | | | | | | | | | | | Applied to the HEAD of linux.git, VERSION = 3 PATCHLEVEL = 11 SUBLEVEL = 0 Signed-off-by: Regid Ichira <regid23@nt1.in> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | cpufreq: remove CONFIG_CPU_FREQ_TABLEViresh Kumar2013-10-161-1/+0
|/ | | | | | | | | CONFIG_CPU_FREQ_TABLE will be always enabled when cpufreq framework is used, as cpufreq core depends on it. So, we don't need this CONFIG option anymore as it is not configurable. Remove CONFIG_CPU_FREQ_TABLE and update its users. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal: hwmon: move hwmon support to single fileEduardo Valentin2013-09-031-0/+9
| | | | | | | | | | | | | | | | | | In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
*-. Merge branches 'exynos', 'imx' and 'fixes' of .git into nextZhang Rui2013-08-151-0/+11
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| * | thermal: add imx thermal driver supportShawn Guo2013-08-131-0/+11
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* | thermal: exynos: Moving exynos thermal files into samsung directoryAmit Daniel Kachhap2013-08-131-8/+5
|/ | | | | | | | | | | | This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Merge branch 'cpu-package-thermal' of .git into nextZhang Rui2013-06-181-2/+1
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| * thermal: fix x86_pkg_temp_thermal.c build and KconfigRandy Dunlap2013-06-181-2/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Fix build error in x86_pkg_temp_thermal.c. It requires that X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol, since it depends on X86_MCE (indirectly). Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block, so remove that duplicated dependency. ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined! ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined! Signed-off-by: Randy Dunlap <rdunlap@infradead.org> Acked-by: Borislav Petkov <bp@suse.de> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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