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* ARM: dts: omap3-igep0030-common: Introduce igep0030 common dtsi file.Enric Balletbo i Serra2014-11-121-49/+9
| | | | | | | | | Use the omap3-igep0030-common.dtsi file and remove repeated parts leaving the nodes that are not common between IGEP COM MODULE hardware revisions. Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com> Acked-by: Javier Martinez Canillas <javier@dowhile0.org> Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: omap3-igep00x0: Move outside common file the on board Wifi module.Enric Balletbo i Serra2014-11-121-0/+39
| | | | | | | | | | New IGEP boards revisions will use another Wifi module, so this patch moves the DT nodes outside the common omap3-igep.dtsi file to specific DT for every board. Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com> Acked-by: Javier Martinez Canillas <javier@dowhile0.org> Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: omap3-igep0030: Specify IGEP COM revision in device tree.Enric Balletbo i Serra2014-11-121-2/+2
| | | | | | | | | | We'll introduce new hardware revisions soon. This patch is only to indicate which board revision supports this device tree file in order to avoid confusions. Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com> Acked-by: Javier Martinez Canillas <javier@dowhile0.org> Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: omap3-igep00x0: Move NAND configuration to a common place.Enric Balletbo i Serra2014-11-121-51/+0
| | | | | | | | | At this moment all supported boards use same NAND chip, so has more sense move the GPMC and NAND configuration to the omap3-igep.dtsi common place. Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com> Acked-by: Javier Martinez Canillas <javier@dowhile0.org> Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: omap3-igep00x0: Fix UART2 pins that aren't common.Enric Balletbo i Serra2014-11-121-0/+16
| | | | | | | | | | | UART2 is used to connect the processor with the bluetooth chip, these pins are not common between IGEPv2 boards and IGEP COM MODULE boards. This patch muxes the correct pins for every board and removes UART2 configuration from common omap3-igep.dtsi file. Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com> Acked-by: Javier Martinez Canillas <javier@dowhile0.org> Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: Fix missing GPMC NAND device width for omap3 boardsTony Lindgren2014-11-031-0/+1
| | | | | | | | Looks like we have some GPMC NAND timings missing device width. This fixes "gpmc_cs_program_settings: invalid width 0!" errors during boot. Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: Fix wrong GPMC size mappings for omapsTony Lindgren2014-10-301-2/+2
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The GPMC binding is obviously very confusing as the values are all over the place. People seem to confuse the GPMC partition size for the chip select, and the device IO size within the GPMC partition easily. The ranges entry contains the GPMC partition size. And the reg entry contains the size of the IO registers of the device connected to the GPMC. Let's fix the issue according to the following table: Device GPMC partition size Device IO size connected in the ranges entry in the reg entry NAND 0x01000000 (16MB) 4 16550 0x01000000 (16MB) 8 smc91x 0x01000000 (16MB) 0xf smc911x 0x01000000 (16MB) 0xff OneNAND 0x01000000 (16MB) 0x20000 (128KB) 16MB NOR 0x01000000 (16MB) 0x01000000 (16MB) 32MB NOR 0x02000000 (32MB) 0x02000000 (32MB) 64MB NOR 0x04000000 (64MB) 0x04000000 (64MB) 128MB NOR 0x08000000 (128MB) 0x08000000 (128MB) 256MB NOR 0x10000000 (256MB) 0x10000000 (256MB) Let's also add comments to the fixed entries while at it. Acked-by: Roger Quadros <rogerq@ti.com> Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: omap3-igep: fix boot fail due wrong compatible matchJavier Martinez Canillas2014-02-281-1/+1
| | | | | | | | | | | | This patch is based on commit: 016c12d2 ("ARM: OMAP3: Fix hardware detection for omap3630 when booted with device tree") and fixes a boot hang due the IGEP board being wrongly initialized as an OMAP3430 platform instead of an OMAP3630. Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk> Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: Split omap3 pinmux core deviceLaurent Pinchart2014-01-071-4/+6
| | | | | | | | | | | | | | | | | | | | | | | | | | | | The omap3_pmx_core pinmux device in the device tree handles the system controller module (SCM) PADCONFS fonction. Its control registers are split in two distinct areas, with other SCM registers in-between. Those other registers can't thus be requested by other drivers as the memory region gets reserved by the pinmux driver. Split the omap3_pmx_core device tree node in two for the two memory regions. The second region address and size depends on the SoC model. The change in omap3.dtsi fixes an "external abort on non-linefetch" when doing cat /sys/kernel/debug/pinctrl/.../pins on a Nokia N900. Note that the core2 padconf region is different for 3430 vs 3630, and does not exist on 3517 as noted by Nishanth Menon <nm@ti.com>. Reported-by: Tomi Valkeinen <tomi.valkeinen@ti.com> Signed-off-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com> Acked-By: Sebastian Reichel <sre@debian.org> Signed-off-by: Nishanth Menon <nm@ti.com> [tony@atomide.com: updated for 3430 vs 3630 core2 based on Nishant's patch] Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: omap3-igep: Update to use the TI AM/DM37x processorEnric Balletbo i Serra2013-11-261-2/+2
| | | | | | | | | | | | | Most of the boards are using the TI AM/DM37x processor, there is only a small quantity of IGEP Processor Boards based on TI OMAP3530. So it's better use the omap36xx.dtsi include instead of omap34xx.dtsi include. We can add support for the 34xx based variant later on as needed. To avoid confusion we have added to the model the (TI AM/DM37x) comment. Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com> [tony@atomide.com: updated comments for the 34xx to 36xx include change] Signed-off-by: Tony Lindgren <tony@atomide.com>
* ARM: dts: Remove '0x's from OMAP3 IGEP0030 DTS fileLee Jones2013-10-081-4/+4
| | | | | | Cc: Tony Lindgren <tony@atomide.com> Signed-off-by: Lee Jones <lee.jones@linaro.org> Signed-off-by: Benoit Cousson <bcousson@baylibre.com>
* ARM: dts: omap3-igep0030: add mux conf for GPIO LEDJavier Martinez Canillas2013-10-081-0/+9
| | | | | | | | | The IGEP COM MOdule has a GPIO LED connected to OMAP pins. Configure this pin as output GPIO. Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk> Tested-by: Enric Balletbo i Serra <eballetbo@iseebcn.com> Signed-off-by: Benoit Cousson <bcousson@baylibre.com>
* ARM: dts: OMAP2+: Use existing constants for GPIOsFlorian Vaussard2013-06-181-4/+4
| | | | | | | | | Use standard GPIO constants to enhance the readability of DT GPIOs. Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch> Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com> Reviewed-by: Stephen Warren <swarren@nvidia.com> Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
* ARM: dts: OMAP2+: Use #include for all device treesFlorian Vaussard2013-06-181-1/+1
| | | | | | | | | | Replace /include/ by #include for OMAP2+ DT, in order to use the C pre-processor, making use of #define features possible. Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch> Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com> Reviewed-by: Stephen Warren <swarren@nvidia.com> Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
* ARM: dts: omap3-igep0030: Add NAND flash supportJavier Martinez Canillas2013-06-181-0/+50
| | | | | | | | | The IGEP COM Module has an 512MB NAND flash memory. Add a device node for this NAND and its partition layout. Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk> Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
* ARM: dts: omap3: Add support for IGEP COM ModuleJavier Martinez Canillas2013-04-091-0/+44
ISEE IGEP COM Module is an TI OMAP3 SoC computer on module. This patch adds an initial device tree support to boot an IGEP COM Module from the MMC/SD. Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk> Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com> [b-cousson@ti.com: Update the Makefile for 3.8-rc2] Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
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