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*---. Merge branches 'exynos-fix', 'for-rc', 'int3403-fix', 'misc', 'rcar-thermal' ↵Zhang Rui2014-07-222-6/+54
|\ \ \ | | | | | | | | | | | | and 'sti-thermal' of .git into next
| | | * thermal: sti: Supply Device Tree documentationLee Jones2014-07-151-0/+42
| | |/ | |/| | | | | | | | | | | | | | | | Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com> Acked-by: Peter Griffin <peter.griffin@linaro.org> Signed-off-by: Lee Jones <lee.jones@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| | * thermal: rcar: Document SoC-specific bindingsGeert Uytterhoeven2014-07-151-6/+12
| |/ | | | | | | | | | | | | | | | | | | | | | | | | The documentation only mentioned the generic fallback compatible property. Add the missing SoC-specific compatible properties, some of which are already in use. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: linux-pm@vger.kernel.org Acked-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: samsung: Add TMU support for Exynos3250 SoCChanwoo Choi2014-07-151-0/+1
|/ | | | | | | | | | | | | This patch add registers, bit fields and compatible strings for Exynos3250 TMU (Thermal Management Unit). Exynos3250 uses the Cortex-A7 dual cores and has a target speed of 1.0 GHz. Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com> [Add MUX address setting bits by Jonghwa Lee] Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kyungmin Park <kyungmin.park@samsung.com> Reviewed-by: Amit Daniel Kachhap<amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
*-. Merge branches 'armada-375-380-soc-support', 'eduardo-thermal-soc-fixes', ↵Zhang Rui2014-05-151-3/+47
|\ \ | | | | | | | | | 'intel-soc-dts-thermal' and 'thermal-soc-fixes' of .git into next
| * | thermal: samsung: Add TMU support for Exynos5260 SoCsNaveen Krishna Chatradhi2014-05-061-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | This patch adds the registers, bit fields and compatible strings required to support for the 5 TMU channels on Exynos5260. Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * | thermal: samsung: Add TMU support for Exynos5420 SoCsNaveen Krishna Chatradhi2014-05-061-1/+44
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Exynos5420 has 5 TMU channels, the TRIMINFO register is misplaced for TMU channels 2, 3 and 4 TRIMINFO at 0x1006c000 contains data for TMU channel 3 TRIMINFO at 0x100a0000 contains data for TMU channel 4 TRIMINFO at 0x10068000 contains data for TMU channel 2 This patch 1 Adds the neccessary register changes and arch information to support Exynos5420 SoCs. 2. Handles the gate clock for misplaced TRIMINFO register 3. Updates the Documentation at Documentation/devicetree/bindings/thermal/exynos-thermal.txt Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Signed-off-by: Andrew Bresticker <abrestic@chromium.org> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: Tomasz Figa <t.figa@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * | thermal: samsung: change base_common to more meaningful base_secondNaveen Krishna Chatradhi2014-05-061-2/+2
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | On Exynos5440 and Exynos5420 there are registers common across the TMU channels. To support that, we introduced a ADDRESS_MULTIPLE flag in the driver and the 2nd set of register base and size are provided in the "reg" property of the node. As per Amit's suggestion, this patch changes the base_common to base_second and SHARED_MEMORY to ADDRESS_MULTIPLE. Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: Tomasz Figa <t.figa@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: armada: Support Armada 380 SoCEzequiel Garcia2014-05-151-1/+2
| | | | | | | | | | | | | | | | | | | | | | Now that a generic infrastructure is in place, it's possible to support the Armada 380 SoC thermal sensor. This sensor is similar to the one available in the already supported SoCs, with its specific temperature formula and specific sensor initialization. Acked-by: Jason Cooper <jason@lakedaemon.net> Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: armada: Support Armada 375 SoCEzequiel Garcia2014-05-151-1/+10
|/ | | | | | | | | | | | | | Now that a generic infrastructure is in place, it's possible to support the new Armada 375 SoC thermal sensor. This sensor is similar to the one available in the already supported SoCs, with its specific temperature formula and specific sensor initialization. In addition, we also add support for the Z1 SoC stepping, which needs an initialization-quirk to work properly. Acked-by: Jason Cooper <jason@lakedaemon.net> Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
*-. Merge branches 'misc' and 'soc' of .git into nextZhang Rui2014-01-031-0/+4
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| | * thermal: imx: add necessary clk operationAnson Huang2014-01-031-0/+4
| |/ | | | | | | | | | | | | | | | | | | | | | | Thermal sensor needs pll3_usb_otg when measuring temperature, otherwise the temperature read will be incorrect, so need to enable this clk before sensor working, for alarm function, as hardware will take measurement periodically, so we should keep this clk always on once alarm function is enabled. Signed-off-by: Anson Huang <b20788@freescale.com> Acked-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: introduce device tree parserEduardo Valentin2013-12-041-0/+595
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
*-. Merge branches 'exynos', 'imx' and 'fixes' of .git into nextZhang Rui2013-08-151-0/+17
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| * | thermal: add imx thermal driver supportShawn Guo2013-08-131-0/+17
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* | ARM: dts: thermal: exynos: Add documentation for Exynos SoC thermal bindingsAmit Daniel Kachhap2013-08-131-0/+55
|/ | | | | | | | | | | | | Proper description for Exynos4 bindings added to Documentation/devicetree/ bindings. It adds description to use multiple TMU instances, optional voltage supply node and optional shared register across multiple TMU's. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: ti-soc-thermal: use standard GPIO DT bindingsEduardo Valentin2013-07-081-4/+5
| | | | | | | | | | | | | | | | | | This change updates the ti-soc-thermal driver to use standard GPIO DT bindings to read the GPIO number associated to thermal shutdown IRQ, in case the device features it. Previously, the code was using a specific DT bindings. As now OMAP supports the standard way to model GPIOs, there is no point in having a ti specific binding. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: ti-soc-thermal: add DT example for DRA752 chipEduardo Valentin2013-06-131-0/+12
| | | | | | | | | | | | | | | | | | Update documentation by adding an example for DRA752 on DT description. Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: ti-soc-thermal: update DT reference for OMAP5430Eduardo Valentin2013-06-131-0/+1
| | | | | | | | | | | | | | | | | Add missing irq line for TALERT on DT entry for OMAP5430. Cc: linux-pm@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: introduce TI SoC thermal driverEduardo Valentin2013-05-281-0/+60
| | | | | | | | | | | | | | | | | | | | | | This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Add driver for Armada 370/XP SoC thermal managementEzequiel Garcia2013-04-021-0/+22
| | | | | | | | | | | | | | | | | | | This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Dove: Add Themal sensor support for Dove.Andrew Lunn2013-02-081-0/+18
| | | | | | | | | The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Add support for the thermal sensor on Kirkwood SoCsNobuhiro Iwamatsu2013-02-081-0/+15
| | | | | | | | This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: rcar: add Device Tree supportKuninori Morimoto2013-02-081-0/+29
| | | | | | | Support for loading the Renesas R-Car thermal module via devicetree. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add ST-Ericsson DB8500 thermal driver.hongbo.zhang2012-11-151-0/+44
| | | | | | | | | | | | | | This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* drivers/thermal/spear_thermal.c: add Device Tree probing capabilityViresh Kumar2012-06-021-0/+14
SPEAr platforms now support DT and so must convert all drivers to support DT. This patch adds DT probing support for SPEAr thermal sensor driver and updates its documentation too. Also, as SPEAr is the only user of this driver and is only available with DT, make this an only DT driver. So, platform_data is completely removed and passed via DT now. Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
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