diff options
23 files changed, 1945 insertions, 50 deletions
diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-cpu0.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-cpu0.txt index 051f764..f055515 100644 --- a/Documentation/devicetree/bindings/cpufreq/cpufreq-cpu0.txt +++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-cpu0.txt @@ -15,6 +15,10 @@ Optional properties: - clock-latency: Specify the possible maximum transition latency for clock, in unit of nanoseconds. - voltage-tolerance: Specify the CPU voltage tolerance in percentage. +- #cooling-cells: +- cooling-min-level: +- cooling-max-level: + Please refer to Documentation/devicetree/bindings/thermal/thermal.txt. Examples: @@ -33,6 +37,9 @@ cpus { 198000 850000 >; clock-latency = <61036>; /* two CLK32 periods */ + #cooling-cells = <2>; + cooling-min-level = <0>; + cooling-max-level = <2>; }; cpu@1 { diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt new file mode 100644 index 0000000..f5db6b7 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal.txt @@ -0,0 +1,595 @@ +* Thermal Framework Device Tree descriptor + +This file describes a generic binding to provide a way of +defining hardware thermal structure using device tree. +A thermal structure includes thermal zones and their components, +such as trip points, polling intervals, sensors and cooling devices +binding descriptors. + +The target of device tree thermal descriptors is to describe only +the hardware thermal aspects. The thermal device tree bindings are +not about how the system must control or which algorithm or policy +must be taken in place. + +There are five types of nodes involved to describe thermal bindings: +- thermal sensors: devices which may be used to take temperature + measurements. +- cooling devices: devices which may be used to dissipate heat. +- trip points: describe key temperatures at which cooling is recommended. The + set of points should be chosen based on hardware limits. +- cooling maps: used to describe links between trip points and cooling devices; +- thermal zones: used to describe thermal data within the hardware; + +The following is a description of each of these node types. + +* Thermal sensor devices + +Thermal sensor devices are nodes providing temperature sensing capabilities on +thermal zones. Typical devices are I2C ADC converters and bandgaps. These are +nodes providing temperature data to thermal zones. Thermal sensor devices may +control one or more internal sensors. + +Required property: +- #thermal-sensor-cells: Used to provide sensor device specific information + Type: unsigned while referring to it. Typically 0 on thermal sensor + Size: one cell nodes with only one sensor, and at least 1 on nodes + with several internal sensors, in order + to identify uniquely the sensor instances within + the IC. See thermal zone binding for more details + on how consumers refer to sensor devices. + +* Cooling device nodes + +Cooling devices are nodes providing control on power dissipation. There +are essentially two ways to provide control on power dissipation. First +is by means of regulating device performance, which is known as passive +cooling. A typical passive cooling is a CPU that has dynamic voltage and +frequency scaling (DVFS), and uses lower frequencies as cooling states. +Second is by means of activating devices in order to remove +the dissipated heat, which is known as active cooling, e.g. regulating +fan speeds. In both cases, cooling devices shall have a way to determine +the state of cooling in which the device is. + +Any cooling device has a range of cooling states (i.e. different levels +of heat dissipation). For example a fan's cooling states correspond to +the different fan speeds possible. Cooling states are referred to by +single unsigned integers, where larger numbers mean greater heat +dissipation. The precise set of cooling states associated with a device +(as referred to be the cooling-min-state and cooling-max-state +properties) should be defined in a particular device's binding. +For more examples of cooling devices, refer to the example sections below. + +Required properties: +- cooling-min-state: An integer indicating the smallest + Type: unsigned cooling state accepted. Typically 0. + Size: one cell + +- cooling-max-state: An integer indicating the largest + Type: unsigned cooling state accepted. + Size: one cell + +- #cooling-cells: Used to provide cooling device specific information + Type: unsigned while referring to it. Must be at least 2, in order + Size: one cell to specify minimum and maximum cooling state used + in the reference. The first cell is the minimum + cooling state requested and the second cell is + the maximum cooling state requested in the reference. + See Cooling device maps section below for more details + on how consumers refer to cooling devices. + +* Trip points + +The trip node is a node to describe a point in the temperature domain +in which the system takes an action. This node describes just the point, +not the action. + +Required properties: +- temperature: An integer indicating the trip temperature level, + Type: signed in millicelsius. + Size: one cell + +- hysteresis: A low hysteresis value on temperature property (above). + Type: unsigned This is a relative value, in millicelsius. + Size: one cell + +- type: a string containing the trip type. Expected values are: + "active": A trip point to enable active cooling + "passive": A trip point to enable passive cooling + "hot": A trip point to notify emergency + "critical": Hardware not reliable. + Type: string + +* Cooling device maps + +The cooling device maps node is a node to describe how cooling devices +get assigned to trip points of the zone. The cooling devices are expected +to be loaded in the target system. + +Required properties: +- cooling-device: A phandle of a cooling device with its specifier, + Type: phandle + referring to which cooling device is used in this + cooling specifier binding. In the cooling specifier, the first cell + is the minimum cooling state and the second cell + is the maximum cooling state used in this map. +- trip: A phandle of a trip point node within the same thermal + Type: phandle of zone. + trip point node + +Optional property: +- contribution: The cooling contribution to the thermal zone of the + Type: unsigned referred cooling device at the referred trip point. + Size: one cell The contribution is a ratio of the sum + of all cooling contributions within a thermal zone. + +Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle +limit specifier means: +(i) - minimum state allowed for minimum cooling state used in the reference. +(ii) - maximum state allowed for maximum cooling state used in the reference. +Refer to include/dt-bindings/thermal/thermal.h for definition of this constant. + +* Thermal zone nodes + +The thermal zone node is the node containing all the required info +for describing a thermal zone, including its cooling device bindings. The +thermal zone node must contain, apart from its own properties, one sub-node +containing trip nodes and one sub-node containing all the zone cooling maps. + +Required properties: +- polling-delay: The maximum number of milliseconds to wait between polls + Type: unsigned when checking this thermal zone. + Size: one cell + +- polling-delay-passive: The maximum number of milliseconds to wait + Type: unsigned between polls when performing passive cooling. + Size: one cell + +- thermal-sensors: A list of thermal sensor phandles and sensor specifier + Type: list of used while monitoring the thermal zone. + phandles + sensor + specifier + +- trips: A sub-node which is a container of only trip point nodes + Type: sub-node required to describe the thermal zone. + +- cooling-maps: A sub-node which is a container of only cooling device + Type: sub-node map nodes, used to describe the relation between trips + and cooling devices. + +Optional property: +- coefficients: An array of integers (one signed cell) containing + Type: array coefficients to compose a linear relation between + Elem size: one cell the sensors listed in the thermal-sensors property. + Elem type: signed Coefficients defaults to 1, in case this property + is not specified. A simple linear polynomial is used: + Z = c0 * x0 + c1 + x1 + ... + c(n-1) * x(n-1) + cn. + + The coefficients are ordered and they match with sensors + by means of sensor ID. Additional coefficients are + interpreted as constant offset. + +Note: The delay properties are bound to the maximum dT/dt (temperature +derivative over time) in two situations for a thermal zone: +(i) - when passive cooling is activated (polling-delay-passive); and +(ii) - when the zone just needs to be monitored (polling-delay) or +when active cooling is activated. + +The maximum dT/dt is highly bound to hardware power consumption and dissipation +capability. The delays should be chosen to account for said max dT/dt, +such that a device does not cross several trip boundaries unexpectedly +between polls. Choosing the right polling delays shall avoid having the +device in temperature ranges that may damage the silicon structures and +reduce silicon lifetime. + +* The thermal-zones node + +The "thermal-zones" node is a container for all thermal zone nodes. It shall +contain only sub-nodes describing thermal zones as in the section +"Thermal zone nodes". The "thermal-zones" node appears under "/". + +* Examples + +Below are several examples on how to use thermal data descriptors +using device tree bindings: + +(a) - CPU thermal zone + +The CPU thermal zone example below describes how to setup one thermal zone +using one single sensor as temperature source and many cooling devices and +power dissipation control sources. + +#include <dt-bindings/thermal/thermal.h> + +cpus { + /* + * Here is an example of describing a cooling device for a DVFS + * capable CPU. The CPU node describes its four OPPs. + * The cooling states possible are 0..3, and they are + * used as OPP indexes. The minimum cooling state is 0, which means + * all four OPPs can be available to the system. The maximum + * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V) + * can be available in the system. + */ + cpu0: cpu@0 { + ... + operating-points = < + /* kHz uV */ + 970000 1200000 + 792000 1100000 + 396000 950000 + 198000 850000 + >; + cooling-min-state = <0>; + cooling-max-state = <3>; + #cooling-cells = <2>; /* min followed by max */ + }; + ... +}; + +&i2c1 { + ... + /* + * A simple fan controller which supports 10 speeds of operation + * (represented as 0-9). + */ + fan0: fan@0x48 { + ... + cooling-min-state = <0>; + cooling-max-state = <9>; + #cooling-cells = <2>; /* min followed by max */ + }; +}; + +ocp { + ... + /* + * A simple IC with a single bandgap temperature sensor. + */ + bandgap0: bandgap@0x0000ED00 { + ... + #thermal-sensor-cells = <0>; + }; +}; + +thermal-zones { + cpu-thermal: cpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + thermal-sensors = <&bandgap0>; + + trips { + cpu-alert0: cpu-alert { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "active"; + }; + cpu-alert1: cpu-alert { + temperature = <100000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + cpu-crit: cpu-crit { + temperature = <125000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu-alert0>; + cooling-device = <&fan0 THERMAL_NO_LIMITS 4>; + }; + map1 { + trip = <&cpu-alert1>; + cooling-device = <&fan0 5 THERMAL_NO_LIMITS>; + }; + map2 { + trip = <&cpu-alert1>; + cooling-device = + <&cpu0 THERMAL_NO_LIMITS THERMAL_NO_LIMITS>; + }; + }; + }; +}; + +In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is +used to monitor the zone 'cpu-thermal' using its sole sensor. A fan +device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten +different cooling states 0-9. It is used to remove the heat out of +the thermal zone 'cpu-thermal' using its cooling states +from its minimum to 4, when it reaches trip point 'cpu-alert0' +at 90C, as an example of active cooling. The same cooling device is used at +'cpu-alert1', but from 5 to its maximum state. The cpu@0 device is also +linked to the same thermal zone, 'cpu-thermal', as a passive cooling device, +using all its cooling states at trip point 'cpu-alert1', +which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the +temperature of 125C, represented by the trip point 'cpu-crit', the silicon +is not reliable anymore. + +(b) - IC with several internal sensors + +The example below describes how to deploy several thermal zones based off a +single sensor IC, assuming it has several internal sensors. This is a common +case on SoC designs with several internal IPs that may need different thermal +requirements, and thus may have their own sensor to monitor or detect internal +hotspots in their silicon. + +#include <dt-bindings/thermal/thermal.h> + +ocp { + ... + /* + * A simple IC with several bandgap temperature sensors. + */ + bandgap0: bandgap@0x0000ED00 { + ... + #thermal-sensor-cells = <1>; + }; +}; + +thermal-zones { + cpu-thermal: cpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap0 0>; + + trips { + /* each zone within the SoC may have its own trips */ + cpu-alert: cpu-alert { + temperature = <100000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + cpu-crit: cpu-crit { + temperature = <125000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + /* each zone within the SoC may have its own cooling */ + ... + }; + }; + + gpu-thermal: gpu-thermal { + polling-delay-passive = <120>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap0 1>; + + trips { + /* each zone within the SoC may have its own trips */ + gpu-alert: gpu-alert { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + gpu-crit: gpu-crit { + temperature = <105000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + /* each zone within the SoC may have its own cooling */ + ... + }; + }; + + dsp-thermal: dsp-thermal { + polling-delay-passive = <50>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap0 2>; + + trips { + /* each zone within the SoC may have its own trips */ + dsp-alert: gpu-alert { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + dsp-crit: gpu-crit { + temperature = <135000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + /* each zone within the SoC may have its own cooling */ + ... + }; + }; +}; + +In the example above, there is one bandgap IC which has the capability to +monitor three sensors. The hardware has been designed so that sensors are +placed on different places in the DIE to monitor different temperature +hotspots: one for CPU thermal zone, one for GPU thermal zone and the +other to monitor a DSP thermal zone. + +Thus, there is a need to assign each sensor provided by the bandgap IC +to different thermal zones. This is achieved by means of using the +#thermal-sensor-cells property and using the first cell of the sensor +specifier as sensor ID. In the example, then, <bandgap 0> is used to +monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal +zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone +may be uncorrelated, having its own dT/dt requirements, trips +and cooling maps. + + +(c) - Several sensors within one single thermal zone + +The example below illustrates how to use more than one sensor within +one thermal zone. + +#include <dt-bindings/thermal/thermal.h> + +&i2c1 { + ... + /* + * A simple IC with a single temperature sensor. + */ + adc: sensor@0x49 { + ... + #thermal-sensor-cells = <0>; + }; +}; + +ocp { + ... + /* + * A simple IC with a single bandgap temperature sensor. + */ + bandgap0: bandgap@0x0000ED00 { + ... + #thermal-sensor-cells = <0>; + }; +}; + +thermal-zones { + cpu-thermal: cpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + thermal-sensors = <&bandgap0>, /* cpu */ + <&adc>; /* pcb north */ + + /* hotspot = 100 * bandgap - 120 * adc + 484 */ + coefficients = <100 -120 484>; + + trips { + ... + }; + + cooling-maps { + ... + }; + }; +}; + +In some cases, there is a need to use more than one sensor to extrapolate +a thermal hotspot in the silicon. The above example illustrates this situation. +For instance, it may be the case that a sensor external to CPU IP may be placed +close to CPU hotspot and together with internal CPU sensor, it is used +to determine the hotspot. Assuming this is the case for the above example, +the hypothetical extrapolation rule would be: + hotspot = 100 * bandgap - 120 * adc + 484 + +In other context, the same idea can be used to add fixed offset. For instance, +consider the hotspot extrapolation rule below: + hotspot = 1 * adc + 6000 + +In the above equation, the hotspot is always 6C higher than what is read +from the ADC sensor. The binding would be then: + thermal-sensors = <&adc>; + + /* hotspot = 1 * adc + 6000 */ + coefficients = <1 6000>; + +(d) - Board thermal + +The board thermal example below illustrates how to setup one thermal zone +with many sensors and many cooling devices. + +#include <dt-bindings/thermal/thermal.h> + +&i2c1 { + ... + /* + * An IC with several temperature sensor. + */ + adc-dummy: sensor@0x50 { + ... + #thermal-sensor-cells = <1>; /* sensor internal ID */ + }; +}; + +thermal-zones { + batt-thermal { + polling-delay-passive = <500>; /* milliseconds */ + polling-delay = <2500>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&adc-dummy 4>; + + trips { + ... + }; + + cooling-maps { + ... + }; + }; + + board-thermal: board-thermal { + polling-delay-passive = <1000>; /* milliseconds */ + polling-delay = <2500>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&adc-dummy 0>, /* pcb top edge */ + <&adc-dummy 1>, /* lcd */ + <&adc-dymmy 2>; /* back cover */ + /* + * An array of coefficients describing the sensor + * linear relation. E.g.: + * z = c1*x1 + c2*x2 + c3*x3 + */ + coefficients = <1200 -345 890>; + + trips { + /* Trips are based on resulting linear equation */ + cpu-trip: cpu-trip { + temperature = <60000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + gpu-trip: gpu-trip { + temperature = <55000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + } + lcd-trip: lcp-trip { + temperature = <53000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + crit-trip: crit-trip { + temperature = <68000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu-trip>; + cooling-device = <&cpu0 0 2>; + contribution = <55>; + }; + map1 { + trip = <&gpu-trip>; + cooling-device = <&gpu0 0 2>; + contribution = <20>; + }; + map2 { + trip = <&lcd-trip>; + cooling-device = <&lcd0 5 10>; + contribution = <15>; + }; + }; + }; +}; + +The above example is a mix of previous examples, a sensor IP with several internal +sensors used to monitor different zones, one of them is composed by several sensors and +with different cooling devices. diff --git a/MAINTAINERS b/MAINTAINERS index 4afcfb4..ec55445 100644 --- a/MAINTAINERS +++ b/MAINTAINERS @@ -8501,6 +8501,7 @@ S: Supported F: drivers/thermal/ F: include/linux/thermal.h F: include/linux/cpu_cooling.h +F: Documentation/devicetree/bindings/thermal/ THINGM BLINK(1) USB RGB LED DRIVER M: Vivien Didelot <vivien.didelot@savoirfairelinux.com> diff --git a/arch/arm/boot/dts/omap4-cpu-thermal.dtsi b/arch/arm/boot/dts/omap4-cpu-thermal.dtsi new file mode 100644 index 0000000..cb9458f --- /dev/null +++ b/arch/arm/boot/dts/omap4-cpu-thermal.dtsi @@ -0,0 +1,41 @@ +/* + * Device Tree Source for OMAP4/5 SoC CPU thermal + * + * Copyright (C) 2013 Texas Instruments Incorporated - http://www.ti.com/ + * Contact: Eduardo Valentin <eduardo.valentin@ti.com> + * + * This file is licensed under the terms of the GNU General Public License + * version 2. This program is licensed "as is" without any warranty of any + * kind, whether express or implied. + */ + +#include <dt-bindings/thermal/thermal.h> + +cpu_thermal: cpu_thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap 0>; + + trips { + cpu_alert0: cpu_alert { + temperature = <100000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + cpu_crit: cpu_crit { + temperature = <125000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_alert0>; + cooling-device = + <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + }; + }; +}; diff --git a/arch/arm/boot/dts/omap443x.dtsi b/arch/arm/boot/dts/omap443x.dtsi index bcf455e..ab607a1 100644 --- a/arch/arm/boot/dts/omap443x.dtsi +++ b/arch/arm/boot/dts/omap443x.dtsi @@ -12,7 +12,7 @@ / { cpus { - cpu@0 { + cpu0: cpu@0 { /* OMAP443x variants OPP50-OPPNT */ operating-points = < /* kHz uV */ @@ -22,12 +22,25 @@ 1008000 1375000 >; clock-latency = <300000>; /* From legacy driver */ + + /* cooling options */ + cooling-min-level = <0>; + cooling-max-level = <3>; + #cooling-cells = <2>; /* min followed by max */ }; }; - bandgap { - reg = <0x4a002260 0x4 - 0x4a00232C 0x4>; - compatible = "ti,omap4430-bandgap"; + thermal-zones { + #include "omap4-cpu-thermal.dtsi" + }; + + ocp { + bandgap: bandgap { + reg = <0x4a002260 0x4 + 0x4a00232C 0x4>; + compatible = "ti,omap4430-bandgap"; + + #thermal-sensor-cells = <0>; + }; }; }; diff --git a/arch/arm/boot/dts/omap4460.dtsi b/arch/arm/boot/dts/omap4460.dtsi index c2f0f39..11566be 100644 --- a/arch/arm/boot/dts/omap4460.dtsi +++ b/arch/arm/boot/dts/omap4460.dtsi @@ -12,7 +12,7 @@ / { cpus { /* OMAP446x 'standard device' variants OPP50 to OPPTurbo */ - cpu@0 { + cpu0: cpu@0 { operating-points = < /* kHz uV */ 350000 1025000 @@ -20,6 +20,11 @@ 920000 1313000 >; clock-latency = <300000>; /* From legacy driver */ + + /* cooling options */ + cooling-min-level = <0>; + cooling-max-level = <2>; + #cooling-cells = <2>; /* min followed by max */ }; }; @@ -30,12 +35,20 @@ ti,hwmods = "debugss"; }; - bandgap { - reg = <0x4a002260 0x4 - 0x4a00232C 0x4 - 0x4a002378 0x18>; - compatible = "ti,omap4460-bandgap"; - interrupts = <0 126 IRQ_TYPE_LEVEL_HIGH>; /* talert */ - gpios = <&gpio3 22 0>; /* tshut */ + thermal-zones { + #include "omap4-cpu-thermal.dtsi" + }; + + ocp { + bandgap: bandgap { + reg = <0x4a002260 0x4 + 0x4a00232C 0x4 + 0x4a002378 0x18>; + compatible = "ti,omap4460-bandgap"; + interrupts = <0 126 IRQ_TYPE_LEVEL_HIGH>; /* talert */ + gpios = <&gpio3 22 0>; /* tshut */ + + #thermal-sensor-cells = <0>; + }; }; }; diff --git a/arch/arm/boot/dts/omap5-core-thermal.dtsi b/arch/arm/boot/dts/omap5-core-thermal.dtsi new file mode 100644 index 0000000..19212ac --- /dev/null +++ b/arch/arm/boot/dts/omap5-core-thermal.dtsi @@ -0,0 +1,28 @@ +/* + * Device Tree Source for OMAP543x SoC CORE thermal + * + * Copyright (C) 2013 Texas Instruments Incorporated - http://www.ti.com/ + * Contact: Eduardo Valentin <eduardo.valentin@ti.com> + * + * This file is licensed under the terms of the GNU General Public License + * version 2. This program is licensed "as is" without any warranty of any + * kind, whether express or implied. + */ + +#include <dt-bindings/thermal/thermal.h> + +core_thermal: core_thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap 2>; + + trips { + core_crit: core_crit { + temperature = <125000>; /* milliCelsius */ + hysteresis = <2000>; /* milliCelsius */ + type = "critical"; + }; + }; +}; diff --git a/arch/arm/boot/dts/omap5-gpu-thermal.dtsi b/arch/arm/boot/dts/omap5-gpu-thermal.dtsi new file mode 100644 index 0000000..1b87aca --- /dev/null +++ b/arch/arm/boot/dts/omap5-gpu-thermal.dtsi @@ -0,0 +1,28 @@ +/* + * Device Tree Source for OMAP543x SoC GPU thermal + * + * Copyright (C) 2013 Texas Instruments Incorporated - http://www.ti.com/ + * Contact: Eduardo Valentin <eduardo.valentin@ti.com> + * + * This file is licensed under the terms of the GNU General Public License + * version 2. This program is licensed "as is" without any warranty of any + * kind, whether express or implied. + */ + +#include <dt-bindings/thermal/thermal.h> + +gpu_thermal: gpu_thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap 1>; + + trips { + gpu_crit: gpu_crit { + temperature = <125000>; /* milliCelsius */ + hysteresis = <2000>; /* milliCelsius */ + type = "critical"; + }; + }; +}; diff --git a/arch/arm/boot/dts/omap5.dtsi b/arch/arm/boot/dts/omap5.dtsi index fc3fad5..ab9a21a 100644 --- a/arch/arm/boot/dts/omap5.dtsi +++ b/arch/arm/boot/dts/omap5.dtsi @@ -49,6 +49,10 @@ 1000000 1060000 1500000 1250000 >; + /* cooling options */ + cooling-min-level = <0>; + cooling-max-level = <2>; + #cooling-cells = <2>; /* min followed by max */ }; cpu@1 { device_type = "cpu"; @@ -57,6 +61,12 @@ }; }; + thermal-zones { + #include "omap4-cpu-thermal.dtsi" + #include "omap5-gpu-thermal.dtsi" + #include "omap5-core-thermal.dtsi" + }; + timer { compatible = "arm,armv7-timer"; /* PPI secure/nonsecure IRQ */ @@ -729,13 +739,15 @@ }; }; - bandgap@4a0021e0 { + bandgap: bandgap@4a0021e0 { reg = <0x4a0021e0 0xc 0x4a00232c 0xc 0x4a002380 0x2c 0x4a0023C0 0x3c>; interrupts = <GIC_SPI 126 IRQ_TYPE_LEVEL_HIGH>; compatible = "ti,omap5430-bandgap"; + + #thermal-sensor-cells = <1>; }; }; }; diff --git a/drivers/cpufreq/Kconfig b/drivers/cpufreq/Kconfig index 38093e2..6b8cde5 100644 --- a/drivers/cpufreq/Kconfig +++ b/drivers/cpufreq/Kconfig @@ -181,7 +181,7 @@ config CPU_FREQ_GOV_CONSERVATIVE config GENERIC_CPUFREQ_CPU0 tristate "Generic CPU0 cpufreq driver" - depends on HAVE_CLK && REGULATOR && PM_OPP && OF + depends on HAVE_CLK && REGULATOR && PM_OPP && OF && THERMAL && CPU_THERMAL help This adds a generic cpufreq driver for CPU0 frequency management. It supports both uniprocessor (UP) and symmetric multiprocessor (SMP) diff --git a/drivers/cpufreq/cpufreq-cpu0.c b/drivers/cpufreq/cpufreq-cpu0.c index d4585ce..91c7bb6 100644 --- a/drivers/cpufreq/cpufreq-cpu0.c +++ b/drivers/cpufreq/cpufreq-cpu0.c @@ -13,7 +13,9 @@ #include <linux/clk.h> #include <linux/cpu.h> +#include <linux/cpu_cooling.h> #include <linux/cpufreq.h> +#include <linux/cpumask.h> #include <linux/err.h> #include <linux/module.h> #include <linux/of.h> @@ -21,6 +23,7 @@ #include <linux/platform_device.h> #include <linux/regulator/consumer.h> #include <linux/slab.h> +#include <linux/thermal.h> static unsigned int transition_latency; static unsigned int voltage_tolerance; /* in percentage */ @@ -29,6 +32,7 @@ static struct device *cpu_dev; static struct clk *cpu_clk; static struct regulator *cpu_reg; static struct cpufreq_frequency_table *freq_table; +static struct thermal_cooling_device *cdev; static unsigned int cpu0_get_speed(unsigned int cpu) { @@ -201,6 +205,17 @@ static int cpu0_cpufreq_probe(struct platform_device *pdev) goto out_free_table; } + /* + * For now, just loading the cooling device; + * thermal DT code takes care of matching them. + */ + if (of_find_property(np, "#cooling-cells", NULL)) { + cdev = of_cpufreq_cooling_register(np, cpu_present_mask); + if (IS_ERR(cdev)) + pr_err("running cpufreq without cooling device: %ld\n", + PTR_ERR(cdev)); + } + of_node_put(np); return 0; @@ -213,6 +228,7 @@ out_put_node: static int cpu0_cpufreq_remove(struct platform_device *pdev) { + cpufreq_cooling_unregister(cdev); cpufreq_unregister_driver(&cpu0_cpufreq_driver); dev_pm_opp_free_cpufreq_table(cpu_dev, &freq_table); diff --git a/drivers/hwmon/lm75.c b/drivers/hwmon/lm75.c index 7e3ef13..84a55ea 100644 --- a/drivers/hwmon/lm75.c +++ b/drivers/hwmon/lm75.c @@ -27,6 +27,8 @@ #include <linux/hwmon-sysfs.h> #include <linux/err.h> #include <linux/mutex.h> +#include <linux/of.h> +#include <linux/thermal.h> #include "lm75.h" @@ -71,6 +73,7 @@ static const u8 LM75_REG_TEMP[3] = { /* Each client has this additional data */ struct lm75_data { struct device *hwmon_dev; + struct thermal_zone_device *tz; struct mutex update_lock; u8 orig_conf; u8 resolution; /* In bits, between 9 and 12 */ @@ -91,22 +94,36 @@ static struct lm75_data *lm75_update_device(struct device *dev); /*-----------------------------------------------------------------------*/ +static inline long lm75_reg_to_mc(s16 temp, u8 resolution) +{ + return ((temp >> (16 - resolution)) * 1000) >> (resolution - 8); +} + /* sysfs attributes for hwmon */ +static int lm75_read_temp(void *dev, long *temp) +{ + struct lm75_data *data = lm75_update_device(dev); + + if (IS_ERR(data)) + return PTR_ERR(data); + + *temp = lm75_reg_to_mc(data->temp[0], data->resolution); + + return 0; +} + static ssize_t show_temp(struct device *dev, struct device_attribute *da, char *buf) { struct sensor_device_attribute *attr = to_sensor_dev_attr(da); struct lm75_data *data = lm75_update_device(dev); - long temp; if (IS_ERR(data)) return PTR_ERR(data); - temp = ((data->temp[attr->index] >> (16 - data->resolution)) * 1000) - >> (data->resolution - 8); - - return sprintf(buf, "%ld\n", temp); + return sprintf(buf, "%ld\n", lm75_reg_to_mc(data->temp[attr->index], + data->resolution)); } static ssize_t set_temp(struct device *dev, struct device_attribute *da, @@ -273,6 +290,13 @@ lm75_probe(struct i2c_client *client, const struct i2c_device_id *id) goto exit_remove; } + data->tz = thermal_zone_of_sensor_register(&client->dev, + 0, + &client->dev, + lm75_read_temp, NULL); + if (IS_ERR(data->tz)) + data->tz = NULL; + dev_info(&client->dev, "%s: sensor '%s'\n", dev_name(data->hwmon_dev), client->name); @@ -287,6 +311,7 @@ static int lm75_remove(struct i2c_client *client) { struct lm75_data *data = i2c_get_clientdata(client); + thermal_zone_of_sensor_unregister(&client->dev, data->tz); hwmon_device_unregister(data->hwmon_dev); sysfs_remove_group(&client->dev.kobj, &lm75_group); lm75_write_value(client, LM75_REG_CONF, data->orig_conf); diff --git a/drivers/hwmon/tmp102.c b/drivers/hwmon/tmp102.c index d7b47ab..6748b45 100644 --- a/drivers/hwmon/tmp102.c +++ b/drivers/hwmon/tmp102.c @@ -27,6 +27,8 @@ #include <linux/mutex.h> #include <linux/device.h> #include <linux/jiffies.h> +#include <linux/thermal.h> +#include <linux/of.h> #define DRIVER_NAME "tmp102" @@ -50,6 +52,7 @@ struct tmp102 { struct device *hwmon_dev; + struct thermal_zone_device *tz; struct mutex lock; u16 config_orig; unsigned long last_update; @@ -93,6 +96,15 @@ static struct tmp102 *tmp102_update_device(struct i2c_client *client) return tmp102; } +static int tmp102_read_temp(void *dev, long *temp) +{ + struct tmp102 *tmp102 = tmp102_update_device(to_i2c_client(dev)); + + *temp = tmp102->temp[0]; + + return 0; +} + static ssize_t tmp102_show_temp(struct device *dev, struct device_attribute *attr, char *buf) @@ -204,6 +216,12 @@ static int tmp102_probe(struct i2c_client *client, goto fail_remove_sysfs; } + tmp102->tz = thermal_zone_of_sensor_register(&client->dev, 0, + &client->dev, + tmp102_read_temp, NULL); + if (IS_ERR(tmp102->tz)) + tmp102->tz = NULL; + dev_info(&client->dev, "initialized\n"); return 0; @@ -220,6 +238,7 @@ static int tmp102_remove(struct i2c_client *client) { struct tmp102 *tmp102 = i2c_get_clientdata(client); + thermal_zone_of_sensor_unregister(&client->dev, tmp102->tz); hwmon_device_unregister(tmp102->hwmon_dev); sysfs_remove_group(&client->dev.kobj, &tmp102_attr_group); diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig index f35a1f7..3feb537 100644 --- a/drivers/thermal/Kconfig +++ b/drivers/thermal/Kconfig @@ -29,6 +29,19 @@ config THERMAL_HWMON Say 'Y' here if you want all thermal sensors to have hwmon sysfs interface too. +config THERMAL_OF + bool + prompt "APIs to parse thermal data out of device tree" + depends on OF + default y + help + This options provides helpers to add the support to + read and parse thermal data definitions out of the + device tree blob. + + Say 'Y' here if you need to build thermal infrastructure + based on device tree. + choice prompt "Default Thermal governor" default THERMAL_DEFAULT_GOV_STEP_WISE @@ -79,6 +92,7 @@ config THERMAL_GOV_USER_SPACE config CPU_THERMAL bool "generic cpu cooling support" depends on CPU_FREQ + depends on THERMAL_OF help This implements the generic cpu cooling mechanism through frequency reduction. An ACPI version of this already exists diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile index 584b363..4b03956 100644 --- a/drivers/thermal/Makefile +++ b/drivers/thermal/Makefile @@ -7,6 +7,7 @@ thermal_sys-y += thermal_core.o # interface to/from other layers providing sensors thermal_sys-$(CONFIG_THERMAL_HWMON) += thermal_hwmon.o +thermal_sys-$(CONFIG_THERMAL_OF) += of-thermal.o # governors thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += fair_share.o diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c index 02a46f2..a6cb553 100644 --- a/drivers/thermal/cpu_cooling.c +++ b/drivers/thermal/cpu_cooling.c @@ -417,18 +417,21 @@ static struct notifier_block thermal_cpufreq_notifier_block = { }; /** - * cpufreq_cooling_register - function to create cpufreq cooling device. + * __cpufreq_cooling_register - helper function to create cpufreq cooling device + * @np: a valid struct device_node to the cooling device device tree node * @clip_cpus: cpumask of cpus where the frequency constraints will happen. * * This interface function registers the cpufreq cooling device with the name * "thermal-cpufreq-%x". This api can support multiple instances of cpufreq - * cooling devices. + * cooling devices. It also gives the opportunity to link the cooling device + * with a device tree node, in order to bind it via the thermal DT code. * * Return: a valid struct thermal_cooling_device pointer on success, * on failure, it returns a corresponding ERR_PTR(). */ -struct thermal_cooling_device * -cpufreq_cooling_register(const struct cpumask *clip_cpus) +static struct thermal_cooling_device * +__cpufreq_cooling_register(struct device_node *np, + const struct cpumask *clip_cpus) { struct thermal_cooling_device *cool_dev; struct cpufreq_cooling_device *cpufreq_dev = NULL; @@ -467,8 +470,8 @@ cpufreq_cooling_register(const struct cpumask *clip_cpus) snprintf(dev_name, sizeof(dev_name), "thermal-cpufreq-%d", cpufreq_dev->id); - cool_dev = thermal_cooling_device_register(dev_name, cpufreq_dev, - &cpufreq_cooling_ops); + cool_dev = thermal_of_cooling_device_register(np, dev_name, cpufreq_dev, + &cpufreq_cooling_ops); if (IS_ERR(cool_dev)) { release_idr(&cpufreq_idr, cpufreq_dev->id); kfree(cpufreq_dev); @@ -488,9 +491,50 @@ cpufreq_cooling_register(const struct cpumask *clip_cpus) return cool_dev; } + +/** + * cpufreq_cooling_register - function to create cpufreq cooling device. + * @clip_cpus: cpumask of cpus where the frequency constraints will happen. + * + * This interface function registers the cpufreq cooling device with the name + * "thermal-cpufreq-%x". This api can support multiple instances of cpufreq + * cooling devices. + * + * Return: a valid struct thermal_cooling_device pointer on success, + * on failure, it returns a corresponding ERR_PTR(). + */ +struct thermal_cooling_device * +cpufreq_cooling_register(const struct cpumask *clip_cpus) +{ + return __cpufreq_cooling_register(NULL, clip_cpus); +} EXPORT_SYMBOL_GPL(cpufreq_cooling_register); /** + * of_cpufreq_cooling_register - function to create cpufreq cooling device. + * @np: a valid struct device_node to the cooling device device tree node + * @clip_cpus: cpumask of cpus where the frequency constraints will happen. + * + * This interface function registers the cpufreq cooling device with the name + * "thermal-cpufreq-%x". This api can support multiple instances of cpufreq + * cooling devices. Using this API, the cpufreq cooling device will be + * linked to the device tree node provided. + * + * Return: a valid struct thermal_cooling_device pointer on success, + * on failure, it returns a corresponding ERR_PTR(). + */ +struct thermal_cooling_device * +of_cpufreq_cooling_register(struct device_node *np, + const struct cpumask *clip_cpus) +{ + if (!np) + return ERR_PTR(-EINVAL); + + return __cpufreq_cooling_register(np, clip_cpus); +} +EXPORT_SYMBOL_GPL(of_cpufreq_cooling_register); + +/** * cpufreq_cooling_unregister - function to remove cpufreq cooling device. * @cdev: thermal cooling device pointer. * diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c new file mode 100644 index 0000000..04b1be7 --- /dev/null +++ b/drivers/thermal/of-thermal.c @@ -0,0 +1,849 @@ +/* + * of-thermal.c - Generic Thermal Management device tree support. + * + * Copyright (C) 2013 Texas Instruments + * Copyright (C) 2013 Eduardo Valentin <eduardo.valentin@ti.com> + * + * + * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ + * + * This program is free software; you can redistribute it and/or modify + * it under the terms of the GNU General Public License as published by + * the Free Software Foundation; version 2 of the License. + * + * This program is distributed in the hope that it will be useful, but + * WITHOUT ANY WARRANTY; without even the implied warranty of + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the GNU + * General Public License for more details. + * + * You should have received a copy of the GNU General Public License along + * with this program; if not, write to the Free Software Foundation, Inc., + * 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA. + * + * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ + */ +#include <linux/thermal.h> +#include <linux/slab.h> +#include <linux/types.h> +#include <linux/of_device.h> +#include <linux/of_platform.h> +#include <linux/err.h> +#include <linux/export.h> +#include <linux/string.h> + +#include "thermal_core.h" + +/*** Private data structures to represent thermal device tree data ***/ + +/** + * struct __thermal_trip - representation of a point in temperature domain + * @np: pointer to struct device_node that this trip point was created from + * @temperature: temperature value in miliCelsius + * @hysteresis: relative hysteresis in miliCelsius + * @type: trip point type + */ + +struct __thermal_trip { + struct device_node *np; + unsigned long int temperature; + unsigned long int hysteresis; + enum thermal_trip_type type; +}; + +/** + * struct __thermal_bind_param - a match between trip and cooling device + * @cooling_device: a pointer to identify the referred cooling device + * @trip_id: the trip point index + * @usage: the percentage (from 0 to 100) of cooling contribution + * @min: minimum cooling state used at this trip point + * @max: maximum cooling state used at this trip point + */ + +struct __thermal_bind_params { + struct device_node *cooling_device; + unsigned int trip_id; + unsigned int usage; + unsigned long min; + unsigned long max; +}; + +/** + * struct __thermal_zone - internal representation of a thermal zone + * @mode: current thermal zone device mode (enabled/disabled) + * @passive_delay: polling interval while passive cooling is activated + * @polling_delay: zone polling interval + * @ntrips: number of trip points + * @trips: an array of trip points (0..ntrips - 1) + * @num_tbps: number of thermal bind params + * @tbps: an array of thermal bind params (0..num_tbps - 1) + * @sensor_data: sensor private data used while reading temperature and trend + * @get_temp: sensor callback to read temperature + * @get_trend: sensor callback to read temperature trend + */ + +struct __thermal_zone { + enum thermal_device_mode mode; + int passive_delay; + int polling_delay; + + /* trip data */ + int ntrips; + struct __thermal_trip *trips; + + /* cooling binding data */ + int num_tbps; + struct __thermal_bind_params *tbps; + + /* sensor interface */ + void *sensor_data; + int (*get_temp)(void *, long *); + int (*get_trend)(void *, long *); +}; + +/*** DT thermal zone device callbacks ***/ + +static int of_thermal_get_temp(struct thermal_zone_device *tz, + unsigned long *temp) +{ + struct __thermal_zone *data = tz->devdata; + + if (!data->get_temp) + return -EINVAL; + + return data->get_temp(data->sensor_data, temp); +} + +static int of_thermal_get_trend(struct thermal_zone_device *tz, int trip, + enum thermal_trend *trend) +{ + struct __thermal_zone *data = tz->devdata; + long dev_trend; + int r; + + if (!data->get_trend) + return -EINVAL; + + r = data->get_trend(data->sensor_data, &dev_trend); + if (r) + return r; + + /* TODO: These intervals might have some thresholds, but in core code */ + if (dev_trend > 0) + *trend = THERMAL_TREND_RAISING; + else if (dev_trend < 0) + *trend = THERMAL_TREND_DROPPING; + else + *trend = THERMAL_TREND_STABLE; + + return 0; +} + +static int of_thermal_bind(struct thermal_zone_device *thermal, + struct thermal_cooling_device *cdev) +{ + struct __thermal_zone *data = thermal->devdata; + int i; + + if (!data || IS_ERR(data)) + return -ENODEV; + + /* find where to bind */ + for (i = 0; i < data->num_tbps; i++) { + struct __thermal_bind_params *tbp = data->tbps + i; + + if (tbp->cooling_device == cdev->np) { + int ret; + + ret = thermal_zone_bind_cooling_device(thermal, + tbp->trip_id, cdev, + tbp->min, + tbp->max); + if (ret) + return ret; + } + } + + return 0; +} + +static int of_thermal_unbind(struct thermal_zone_device *thermal, + struct thermal_cooling_device *cdev) +{ + struct __thermal_zone *data = thermal->devdata; + int i; + + if (!data || IS_ERR(data)) + return -ENODEV; + + /* find where to unbind */ + for (i = 0; i < data->num_tbps; i++) { + struct __thermal_bind_params *tbp = data->tbps + i; + + if (tbp->cooling_device == cdev->np) { + int ret; + + ret = thermal_zone_unbind_cooling_device(thermal, + tbp->trip_id, cdev); + if (ret) + return ret; + } + } + + return 0; +} + +static int of_thermal_get_mode(struct thermal_zone_device *tz, + enum thermal_device_mode *mode) +{ + struct __thermal_zone *data = tz->devdata; + + *mode = data->mode; + + return 0; +} + +static int of_thermal_set_mode(struct thermal_zone_device *tz, + enum thermal_device_mode mode) +{ + struct __thermal_zone *data = tz->devdata; + + mutex_lock(&tz->lock); + + if (mode == THERMAL_DEVICE_ENABLED) + tz->polling_delay = data->polling_delay; + else + tz->polling_delay = 0; + + mutex_unlock(&tz->lock); + + data->mode = mode; + thermal_zone_device_update(tz); + + return 0; +} + +static int of_thermal_get_trip_type(struct thermal_zone_device *tz, int trip, + enum thermal_trip_type *type) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + *type = data->trips[trip].type; + + return 0; +} + +static int of_thermal_get_trip_temp(struct thermal_zone_device *tz, int trip, + unsigned long *temp) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + *temp = data->trips[trip].temperature; + + return 0; +} + +static int of_thermal_set_trip_temp(struct thermal_zone_device *tz, int trip, + unsigned long temp) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + /* thermal framework should take care of data->mask & (1 << trip) */ + data->trips[trip].temperature = temp; + + return 0; +} + +static int of_thermal_get_trip_hyst(struct thermal_zone_device *tz, int trip, + unsigned long *hyst) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + *hyst = data->trips[trip].hysteresis; + + return 0; +} + +static int of_thermal_set_trip_hyst(struct thermal_zone_device *tz, int trip, + unsigned long hyst) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + /* thermal framework should take care of data->mask & (1 << trip) */ + data->trips[trip].hysteresis = hyst; + + return 0; +} + +static int of_thermal_get_crit_temp(struct thermal_zone_device *tz, + unsigned long *temp) +{ + struct __thermal_zone *data = tz->devdata; + int i; + + for (i = 0; i < data->ntrips; i++) + if (data->trips[i].type == THERMAL_TRIP_CRITICAL) { + *temp = data->trips[i].temperature; + return 0; + } + + return -EINVAL; +} + +static struct thermal_zone_device_ops of_thermal_ops = { + .get_mode = of_thermal_get_mode, + .set_mode = of_thermal_set_mode, + + .get_trip_type = of_thermal_get_trip_type, + .get_trip_temp = of_thermal_get_trip_temp, + .set_trip_temp = of_thermal_set_trip_temp, + .get_trip_hyst = of_thermal_get_trip_hyst, + .set_trip_hyst = of_thermal_set_trip_hyst, + .get_crit_temp = of_thermal_get_crit_temp, + + .bind = of_thermal_bind, + .unbind = of_thermal_unbind, +}; + +/*** sensor API ***/ + +static struct thermal_zone_device * +thermal_zone_of_add_sensor(struct device_node *zone, + struct device_node *sensor, void *data, + int (*get_temp)(void *, long *), + int (*get_trend)(void *, long *)) +{ + struct thermal_zone_device *tzd; + struct __thermal_zone *tz; + + tzd = thermal_zone_get_zone_by_name(zone->name); + if (IS_ERR(tzd)) + return ERR_PTR(-EPROBE_DEFER); + + tz = tzd->devdata; + + mutex_lock(&tzd->lock); + tz->get_temp = get_temp; + tz->get_trend = get_trend; + tz->sensor_data = data; + + tzd->ops->get_temp = of_thermal_get_temp; + tzd->ops->get_trend = of_thermal_get_trend; + mutex_unlock(&tzd->lock); + + return tzd; +} + +/** + * thermal_zone_of_sensor_register - registers a sensor to a DT thermal zone + * @dev: a valid struct device pointer of a sensor device. Must contain + * a valid .of_node, for the sensor node. + * @sensor_id: a sensor identifier, in case the sensor IP has more + * than one sensors + * @data: a private pointer (owned by the caller) that will be passed + * back, when a temperature reading is needed. + * @get_temp: a pointer to a function that reads the sensor temperature. + * @get_trend: a pointer to a function that reads the sensor temperature trend. + * + * This function will search the list of thermal zones described in device + * tree and look for the zone that refer to the sensor device pointed by + * @dev->of_node as temperature providers. For the zone pointing to the + * sensor node, the sensor will be added to the DT thermal zone device. + * + * The thermal zone temperature is provided by the @get_temp function + * pointer. When called, it will have the private pointer @data back. + * + * The thermal zone temperature trend is provided by the @get_trend function + * pointer. When called, it will have the private pointer @data back. + * + * TODO: + * 01 - This function must enqueue the new sensor instead of using + * it as the only source of temperature values. + * + * 02 - There must be a way to match the sensor with all thermal zones + * that refer to it. + * + * Return: On success returns a valid struct thermal_zone_device, + * otherwise, it returns a corresponding ERR_PTR(). Caller must + * check the return value with help of IS_ERR() helper. + */ +struct thermal_zone_device * +thermal_zone_of_sensor_register(struct device *dev, int sensor_id, + void *data, int (*get_temp)(void *, long *), + int (*get_trend)(void *, long *)) +{ + struct device_node *np, *child, *sensor_np; + + np = of_find_node_by_name(NULL, "thermal-zones"); + if (!np) + return ERR_PTR(-ENODEV); + + if (!dev || !dev->of_node) + return ERR_PTR(-EINVAL); + + sensor_np = dev->of_node; + + for_each_child_of_node(np, child) { + struct of_phandle_args sensor_specs; + int ret, id; + + /* For now, thermal framework supports only 1 sensor per zone */ + ret = of_parse_phandle_with_args(child, "thermal-sensors", + "#thermal-sensor-cells", + 0, &sensor_specs); + if (ret) + continue; + + if (sensor_specs.args_count >= 1) { + id = sensor_specs.args[0]; + WARN(sensor_specs.args_count > 1, + "%s: too many cells in sensor specifier %d\n", + sensor_specs.np->name, sensor_specs.args_count); + } else { + id = 0; + } + + if (sensor_specs.np == sensor_np && id == sensor_id) { + of_node_put(np); + return thermal_zone_of_add_sensor(child, sensor_np, + data, + get_temp, + get_trend); + } + } + of_node_put(np); + + return ERR_PTR(-ENODEV); +} +EXPORT_SYMBOL_GPL(thermal_zone_of_sensor_register); + +/** + * thermal_zone_of_sensor_unregister - unregisters a sensor from a DT thermal zone + * @dev: a valid struct device pointer of a sensor device. Must contain + * a valid .of_node, for the sensor node. + * @tzd: a pointer to struct thermal_zone_device where the sensor is registered. + * + * This function removes the sensor callbacks and private data from the + * thermal zone device registered with thermal_zone_of_sensor_register() + * API. It will also silent the zone by remove the .get_temp() and .get_trend() + * thermal zone device callbacks. + * + * TODO: When the support to several sensors per zone is added, this + * function must search the sensor list based on @dev parameter. + * + */ +void thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tzd) +{ + struct __thermal_zone *tz; + + if (!dev || !tzd || !tzd->devdata) + return; + + tz = tzd->devdata; + + /* no __thermal_zone, nothing to be done */ + if (!tz) + return; + + mutex_lock(&tzd->lock); + tzd->ops->get_temp = NULL; + tzd->ops->get_trend = NULL; + + tz->get_temp = NULL; + tz->get_trend = NULL; + tz->sensor_data = NULL; + mutex_unlock(&tzd->lock); +} +EXPORT_SYMBOL_GPL(thermal_zone_of_sensor_unregister); + +/*** functions parsing device tree nodes ***/ + +/** + * thermal_of_populate_bind_params - parse and fill cooling map data + * @np: DT node containing a cooling-map node + * @__tbp: data structure to be filled with cooling map info + * @trips: array of thermal zone trip points + * @ntrips: number of trip points inside trips. + * + * This function parses a cooling-map type of node represented by + * @np parameter and fills the read data into @__tbp data structure. + * It needs the already parsed array of trip points of the thermal zone + * in consideration. + * + * Return: 0 on success, proper error code otherwise + */ +static int thermal_of_populate_bind_params(struct device_node *np, + struct __thermal_bind_params *__tbp, + struct __thermal_trip *trips, + int ntrips) +{ + struct of_phandle_args cooling_spec; + struct device_node *trip; + int ret, i; + u32 prop; + + /* Default weight. Usage is optional */ + __tbp->usage = 0; + ret = of_property_read_u32(np, "contribution", &prop); + if (ret == 0) + __tbp->usage = prop; + + trip = of_parse_phandle(np, "trip", 0); + if (!trip) { + pr_err("missing trip property\n"); + return -ENODEV; + } + + /* match using device_node */ + for (i = 0; i < ntrips; i++) + if (trip == trips[i].np) { + __tbp->trip_id = i; + break; + } + + if (i == ntrips) { + ret = -ENODEV; + goto end; + } + + ret = of_parse_phandle_with_args(np, "cooling-device", "#cooling-cells", + 0, &cooling_spec); + if (ret < 0) { + pr_err("missing cooling_device property\n"); + goto end; + } + __tbp->cooling_device = cooling_spec.np; + if (cooling_spec.args_count >= 2) { /* at least min and max */ + __tbp->min = cooling_spec.args[0]; + __tbp->max = cooling_spec.args[1]; + } else { + pr_err("wrong reference to cooling device, missing limits\n"); + } + +end: + of_node_put(trip); + + return ret; +} + +/** + * It maps 'enum thermal_trip_type' found in include/linux/thermal.h + * into the device tree binding of 'trip', property type. + */ +static const char * const trip_types[] = { + [THERMAL_TRIP_ACTIVE] = "active", + [THERMAL_TRIP_PASSIVE] = "passive", + [THERMAL_TRIP_HOT] = "hot", + [THERMAL_TRIP_CRITICAL] = "critical", +}; + +/** + * thermal_of_get_trip_type - Get phy mode for given device_node + * @np: Pointer to the given device_node + * @type: Pointer to resulting trip type + * + * The function gets trip type string from property 'type', + * and store its index in trip_types table in @type, + * + * Return: 0 on success, or errno in error case. + */ +static int thermal_of_get_trip_type(struct device_node *np, + enum thermal_trip_type *type) +{ + const char *t; + int err, i; + + err = of_property_read_string(np, "type", &t); + if (err < 0) + return err; + + for (i = 0; i < ARRAY_SIZE(trip_types); i++) + if (!strcasecmp(t, trip_types[i])) { + *type = i; + return 0; + } + + return -ENODEV; +} + +/** + * thermal_of_populate_trip - parse and fill one trip point data + * @np: DT node containing a trip point node + * @trip: trip point data structure to be filled up + * + * This function parses a trip point type of node represented by + * @np parameter and fills the read data into @trip data structure. + * + * Return: 0 on success, proper error code otherwise + */ +static int thermal_of_populate_trip(struct device_node *np, + struct __thermal_trip *trip) +{ + int prop; + int ret; + + ret = of_property_read_u32(np, "temperature", &prop); + if (ret < 0) { + pr_err("missing temperature property\n"); + return ret; + } + trip->temperature = prop; + + ret = of_property_read_u32(np, "hysteresis", &prop); + if (ret < 0) { + pr_err("missing hysteresis property\n"); + return ret; + } + trip->hysteresis = prop; + + ret = thermal_of_get_trip_type(np, &trip->type); + if (ret < 0) { + pr_err("wrong trip type property\n"); + return ret; + } + + /* Required for cooling map matching */ + trip->np = np; + + return 0; +} + +/** + * thermal_of_build_thermal_zone - parse and fill one thermal zone data + * @np: DT node containing a thermal zone node + * + * This function parses a thermal zone type of node represented by + * @np parameter and fills the read data into a __thermal_zone data structure + * and return this pointer. + * + * TODO: Missing properties to parse: thermal-sensor-names and coefficients + * + * Return: On success returns a valid struct __thermal_zone, + * otherwise, it returns a corresponding ERR_PTR(). Caller must + * check the return value with help of IS_ERR() helper. + */ +static struct __thermal_zone * +thermal_of_build_thermal_zone(struct device_node *np) +{ + struct device_node *child = NULL, *gchild; + struct __thermal_zone *tz; + int ret, i; + u32 prop; + + if (!np) { + pr_err("no thermal zone np\n"); + return ERR_PTR(-EINVAL); + } + + tz = kzalloc(sizeof(*tz), GFP_KERNEL); + if (!tz) + return ERR_PTR(-ENOMEM); + + ret = of_property_read_u32(np, "polling-delay-passive", &prop); + if (ret < 0) { + pr_err("missing polling-delay-passive property\n"); + goto free_tz; + } + tz->passive_delay = prop; + + ret = of_property_read_u32(np, "polling-delay", &prop); + if (ret < 0) { + pr_err("missing polling-delay property\n"); + goto free_tz; + } + tz->polling_delay = prop; + + /* trips */ + child = of_get_child_by_name(np, "trips"); + + /* No trips provided */ + if (!child) + goto finish; + + tz->ntrips = of_get_child_count(child); + if (tz->ntrips == 0) /* must have at least one child */ + goto finish; + + tz->trips = kzalloc(tz->ntrips * sizeof(*tz->trips), GFP_KERNEL); + if (!tz->trips) { + ret = -ENOMEM; + goto free_tz; + } + + i = 0; + for_each_child_of_node(child, gchild) { + ret = thermal_of_populate_trip(gchild, &tz->trips[i++]); + if (ret) + goto free_trips; + } + + of_node_put(child); + + /* cooling-maps */ + child = of_get_child_by_name(np, "cooling-maps"); + + /* cooling-maps not provided */ + if (!child) + goto finish; + + tz->num_tbps = of_get_child_count(child); + if (tz->num_tbps == 0) + goto finish; + + tz->tbps = kzalloc(tz->num_tbps * sizeof(*tz->tbps), GFP_KERNEL); + if (!tz->tbps) { + ret = -ENOMEM; + goto free_trips; + } + + i = 0; + for_each_child_of_node(child, gchild) + ret = thermal_of_populate_bind_params(gchild, &tz->tbps[i++], + tz->trips, tz->ntrips); + if (ret) + goto free_tbps; + +finish: + of_node_put(child); + tz->mode = THERMAL_DEVICE_DISABLED; + + return tz; + +free_tbps: + kfree(tz->tbps); +free_trips: + kfree(tz->trips); +free_tz: + kfree(tz); + of_node_put(child); + + return ERR_PTR(ret); +} + +static inline void of_thermal_free_zone(struct __thermal_zone *tz) +{ + kfree(tz->tbps); + kfree(tz->trips); + kfree(tz); +} + +/** + * of_parse_thermal_zones - parse device tree thermal data + * + * Initialization function that can be called by machine initialization + * code to parse thermal data and populate the thermal framework + * with hardware thermal zones info. This function only parses thermal zones. + * Cooling devices and sensor devices nodes are supposed to be parsed + * by their respective drivers. + * + * Return: 0 on success, proper error code otherwise + * + */ +int __init of_parse_thermal_zones(void) +{ + struct device_node *np, *child; + struct __thermal_zone *tz; + struct thermal_zone_device_ops *ops; + + np = of_find_node_by_name(NULL, "thermal-zones"); + if (!np) { + pr_debug("unable to find thermal zones\n"); + return 0; /* Run successfully on systems without thermal DT */ + } + + for_each_child_of_node(np, child) { + struct thermal_zone_device *zone; + struct thermal_zone_params *tzp; + + tz = thermal_of_build_thermal_zone(child); + if (IS_ERR(tz)) { + pr_err("failed to build thermal zone %s: %ld\n", + child->name, + PTR_ERR(tz)); + continue; + } + + ops = kmemdup(&of_thermal_ops, sizeof(*ops), GFP_KERNEL); + if (!ops) + goto exit_free; + + tzp = kzalloc(sizeof(*tzp), GFP_KERNEL); + if (!tzp) { + kfree(ops); + goto exit_free; + } + + /* No hwmon because there might be hwmon drivers registering */ + tzp->no_hwmon = true; + + zone = thermal_zone_device_register(child->name, tz->ntrips, + 0, tz, + ops, tzp, + tz->passive_delay, + tz->polling_delay); + if (IS_ERR(zone)) { + pr_err("Failed to build %s zone %ld\n", child->name, + PTR_ERR(zone)); + kfree(tzp); + kfree(ops); + of_thermal_free_zone(tz); + /* attempting to build remaining zones still */ + } + } + + return 0; + +exit_free: + of_thermal_free_zone(tz); + + /* no memory available, so free what we have built */ + of_thermal_destroy_zones(); + + return -ENOMEM; +} + +/** + * of_thermal_destroy_zones - remove all zones parsed and allocated resources + * + * Finds all zones parsed and added to the thermal framework and remove them + * from the system, together with their resources. + * + */ +void of_thermal_destroy_zones(void) +{ + struct device_node *np, *child; + + np = of_find_node_by_name(NULL, "thermal-zones"); + if (!np) { + pr_err("unable to find thermal zones\n"); + return; + } + + for_each_child_of_node(np, child) { + struct thermal_zone_device *zone; + + zone = thermal_zone_get_zone_by_name(child->name); + if (IS_ERR(zone)) + continue; + + thermal_zone_device_unregister(zone); + kfree(zone->tzp); + kfree(zone->ops); + of_thermal_free_zone(zone->devdata); + } +} diff --git a/drivers/thermal/thermal_core.c b/drivers/thermal/thermal_core.c index f1d511a..e381d52 100644 --- a/drivers/thermal/thermal_core.c +++ b/drivers/thermal/thermal_core.c @@ -34,6 +34,7 @@ #include <linux/thermal.h> #include <linux/reboot.h> #include <linux/string.h> +#include <linux/of.h> #include <net/netlink.h> #include <net/genetlink.h> @@ -403,7 +404,7 @@ int thermal_zone_get_temp(struct thermal_zone_device *tz, unsigned long *temp) enum thermal_trip_type type; #endif - if (!tz || IS_ERR(tz)) + if (!tz || IS_ERR(tz) || !tz->ops->get_temp) goto exit; mutex_lock(&tz->lock); @@ -456,6 +457,9 @@ void thermal_zone_device_update(struct thermal_zone_device *tz) { int count; + if (!tz->ops->get_temp) + return; + update_temperature(tz); for (count = 0; count < tz->trips; count++) @@ -1052,7 +1056,8 @@ static struct class thermal_class = { }; /** - * thermal_cooling_device_register() - register a new thermal cooling device + * __thermal_cooling_device_register() - register a new thermal cooling device + * @np: a pointer to a device tree node. * @type: the thermal cooling device type. * @devdata: device private data. * @ops: standard thermal cooling devices callbacks. @@ -1060,13 +1065,16 @@ static struct class thermal_class = { * This interface function adds a new thermal cooling device (fan/processor/...) * to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself * to all the thermal zone devices registered at the same time. + * It also gives the opportunity to link the cooling device to a device tree + * node, so that it can be bound to a thermal zone created out of device tree. * * Return: a pointer to the created struct thermal_cooling_device or an * ERR_PTR. Caller must check return value with IS_ERR*() helpers. */ -struct thermal_cooling_device * -thermal_cooling_device_register(char *type, void *devdata, - const struct thermal_cooling_device_ops *ops) +static struct thermal_cooling_device * +__thermal_cooling_device_register(struct device_node *np, + char *type, void *devdata, + const struct thermal_cooling_device_ops *ops) { struct thermal_cooling_device *cdev; int result; @@ -1091,6 +1099,7 @@ thermal_cooling_device_register(char *type, void *devdata, strlcpy(cdev->type, type ? : "", sizeof(cdev->type)); mutex_init(&cdev->lock); INIT_LIST_HEAD(&cdev->thermal_instances); + cdev->np = np; cdev->ops = ops; cdev->updated = true; cdev->device.class = &thermal_class; @@ -1133,9 +1142,53 @@ unregister: device_unregister(&cdev->device); return ERR_PTR(result); } + +/** + * thermal_cooling_device_register() - register a new thermal cooling device + * @type: the thermal cooling device type. + * @devdata: device private data. + * @ops: standard thermal cooling devices callbacks. + * + * This interface function adds a new thermal cooling device (fan/processor/...) + * to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself + * to all the thermal zone devices registered at the same time. + * + * Return: a pointer to the created struct thermal_cooling_device or an + * ERR_PTR. Caller must check return value with IS_ERR*() helpers. + */ +struct thermal_cooling_device * +thermal_cooling_device_register(char *type, void *devdata, + const struct thermal_cooling_device_ops *ops) +{ + return __thermal_cooling_device_register(NULL, type, devdata, ops); +} EXPORT_SYMBOL_GPL(thermal_cooling_device_register); /** + * thermal_of_cooling_device_register() - register an OF thermal cooling device + * @np: a pointer to a device tree node. + * @type: the thermal cooling device type. + * @devdata: device private data. + * @ops: standard thermal cooling devices callbacks. + * + * This function will register a cooling device with device tree node reference. + * This interface function adds a new thermal cooling device (fan/processor/...) + * to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself + * to all the thermal zone devices registered at the same time. + * + * Return: a pointer to the created struct thermal_cooling_device or an + * ERR_PTR. Caller must check return value with IS_ERR*() helpers. + */ +struct thermal_cooling_device * +thermal_of_cooling_device_register(struct device_node *np, + char *type, void *devdata, + const struct thermal_cooling_device_ops *ops) +{ + return __thermal_cooling_device_register(np, type, devdata, ops); +} +EXPORT_SYMBOL_GPL(thermal_of_cooling_device_register); + +/** * thermal_cooling_device_unregister - removes the registered thermal cooling device * @cdev: the thermal cooling device to remove. * @@ -1370,7 +1423,7 @@ static void remove_trip_attrs(struct thermal_zone_device *tz) */ struct thermal_zone_device *thermal_zone_device_register(const char *type, int trips, int mask, void *devdata, - const struct thermal_zone_device_ops *ops, + struct thermal_zone_device_ops *ops, const struct thermal_zone_params *tzp, int passive_delay, int polling_delay) { @@ -1386,7 +1439,7 @@ struct thermal_zone_device *thermal_zone_device_register(const char *type, if (trips > THERMAL_MAX_TRIPS || trips < 0 || mask >> trips) return ERR_PTR(-EINVAL); - if (!ops || !ops->get_temp) + if (!ops) return ERR_PTR(-EINVAL); if (trips > 0 && (!ops->get_trip_type || !ops->get_trip_temp)) @@ -1490,6 +1543,9 @@ struct thermal_zone_device *thermal_zone_device_register(const char *type, INIT_DELAYED_WORK(&(tz->poll_queue), thermal_zone_device_check); + if (!tz->ops->get_temp) + thermal_zone_device_set_polling(tz, 0); + thermal_zone_device_update(tz); if (!result) @@ -1740,8 +1796,14 @@ static int __init thermal_init(void) if (result) goto unregister_class; + result = of_parse_thermal_zones(); + if (result) + goto exit_netlink; + return 0; +exit_netlink: + genetlink_exit(); unregister_governors: thermal_unregister_governors(); unregister_class: @@ -1757,6 +1819,7 @@ error: static void __exit thermal_exit(void) { + of_thermal_destroy_zones(); genetlink_exit(); class_unregister(&thermal_class); thermal_unregister_governors(); diff --git a/drivers/thermal/thermal_core.h b/drivers/thermal/thermal_core.h index 7cf2f66..3db339f 100644 --- a/drivers/thermal/thermal_core.h +++ b/drivers/thermal/thermal_core.h @@ -77,4 +77,13 @@ static inline int thermal_gov_user_space_register(void) { return 0; } static inline void thermal_gov_user_space_unregister(void) {} #endif /* CONFIG_THERMAL_GOV_USER_SPACE */ +/* device tree support */ +#ifdef CONFIG_THERMAL_OF +int of_parse_thermal_zones(void); +void of_thermal_destroy_zones(void); +#else +static inline int of_parse_thermal_zones(void) { return 0; } +static inline void of_thermal_destroy_zones(void) { } +#endif + #endif /* __THERMAL_CORE_H__ */ diff --git a/drivers/thermal/ti-soc-thermal/ti-thermal-common.c b/drivers/thermal/ti-soc-thermal/ti-thermal-common.c index 5a47cc8..9eec26d 100644 --- a/drivers/thermal/ti-soc-thermal/ti-thermal-common.c +++ b/drivers/thermal/ti-soc-thermal/ti-thermal-common.c @@ -31,6 +31,7 @@ #include <linux/cpufreq.h> #include <linux/cpumask.h> #include <linux/cpu_cooling.h> +#include <linux/of.h> #include "ti-thermal.h" #include "ti-bandgap.h" @@ -44,6 +45,7 @@ struct ti_thermal_data { enum thermal_device_mode mode; struct work_struct thermal_wq; int sensor_id; + bool our_zone; }; static void ti_thermal_work(struct work_struct *work) @@ -75,11 +77,10 @@ static inline int ti_thermal_hotspot_temperature(int t, int s, int c) /* thermal zone ops */ /* Get temperature callback function for thermal zone*/ -static inline int ti_thermal_get_temp(struct thermal_zone_device *thermal, - unsigned long *temp) +static inline int __ti_thermal_get_temp(void *devdata, long *temp) { struct thermal_zone_device *pcb_tz = NULL; - struct ti_thermal_data *data = thermal->devdata; + struct ti_thermal_data *data = devdata; struct ti_bandgap *bgp; const struct ti_temp_sensor *s; int ret, tmp, slope, constant; @@ -118,6 +119,14 @@ static inline int ti_thermal_get_temp(struct thermal_zone_device *thermal, return ret; } +static inline int ti_thermal_get_temp(struct thermal_zone_device *thermal, + unsigned long *temp) +{ + struct ti_thermal_data *data = thermal->devdata; + + return __ti_thermal_get_temp(data, temp); +} + /* Bind callback functions for thermal zone */ static int ti_thermal_bind(struct thermal_zone_device *thermal, struct thermal_cooling_device *cdev) @@ -230,11 +239,9 @@ static int ti_thermal_get_trip_temp(struct thermal_zone_device *thermal, return 0; } -/* Get the temperature trend callback functions for thermal zone */ -static int ti_thermal_get_trend(struct thermal_zone_device *thermal, - int trip, enum thermal_trend *trend) +static int __ti_thermal_get_trend(void *p, long *trend) { - struct ti_thermal_data *data = thermal->devdata; + struct ti_thermal_data *data = p; struct ti_bandgap *bgp; int id, tr, ret = 0; @@ -245,6 +252,22 @@ static int ti_thermal_get_trend(struct thermal_zone_device *thermal, if (ret) return ret; + *trend = tr; + + return 0; +} + +/* Get the temperature trend callback functions for thermal zone */ +static int ti_thermal_get_trend(struct thermal_zone_device *thermal, + int trip, enum thermal_trend *trend) +{ + int ret; + long tr; + + ret = __ti_thermal_get_trend(thermal->devdata, &tr); + if (ret) + return ret; + if (tr > 0) *trend = THERMAL_TREND_RAISING; else if (tr < 0) @@ -308,16 +331,23 @@ int ti_thermal_expose_sensor(struct ti_bandgap *bgp, int id, if (!data) return -EINVAL; - /* Create thermal zone */ - data->ti_thermal = thermal_zone_device_register(domain, + /* in case this is specified by DT */ + data->ti_thermal = thermal_zone_of_sensor_register(bgp->dev, id, + data, __ti_thermal_get_temp, + __ti_thermal_get_trend); + if (IS_ERR(data->ti_thermal)) { + /* Create thermal zone */ + data->ti_thermal = thermal_zone_device_register(domain, OMAP_TRIP_NUMBER, 0, data, &ti_thermal_ops, NULL, FAST_TEMP_MONITORING_RATE, FAST_TEMP_MONITORING_RATE); - if (IS_ERR(data->ti_thermal)) { - dev_err(bgp->dev, "thermal zone device is NULL\n"); - return PTR_ERR(data->ti_thermal); + if (IS_ERR(data->ti_thermal)) { + dev_err(bgp->dev, "thermal zone device is NULL\n"); + return PTR_ERR(data->ti_thermal); + } + data->ti_thermal->polling_delay = FAST_TEMP_MONITORING_RATE; + data->our_zone = true; } - data->ti_thermal->polling_delay = FAST_TEMP_MONITORING_RATE; ti_bandgap_set_sensor_data(bgp, id, data); ti_bandgap_write_update_interval(bgp, data->sensor_id, data->ti_thermal->polling_delay); @@ -331,7 +361,13 @@ int ti_thermal_remove_sensor(struct ti_bandgap *bgp, int id) data = ti_bandgap_get_sensor_data(bgp, id); - thermal_zone_device_unregister(data->ti_thermal); + if (data && data->ti_thermal) { + if (data->our_zone) + thermal_zone_device_unregister(data->ti_thermal); + else + thermal_zone_of_sensor_unregister(bgp->dev, + data->ti_thermal); + } return 0; } @@ -350,6 +386,15 @@ int ti_thermal_report_sensor_temperature(struct ti_bandgap *bgp, int id) int ti_thermal_register_cpu_cooling(struct ti_bandgap *bgp, int id) { struct ti_thermal_data *data; + struct device_node *np = bgp->dev->of_node; + + /* + * We are assuming here that if one deploys the zone + * using DT, then it must be aware that the cooling device + * loading has to happen via cpufreq driver. + */ + if (of_find_property(np, "#thermal-sensor-cells", NULL)) + return 0; data = ti_bandgap_get_sensor_data(bgp, id); if (!data || IS_ERR(data)) @@ -380,7 +425,9 @@ int ti_thermal_unregister_cpu_cooling(struct ti_bandgap *bgp, int id) struct ti_thermal_data *data; data = ti_bandgap_get_sensor_data(bgp, id); - cpufreq_cooling_unregister(data->cool_dev); + + if (data && data->cool_dev) + cpufreq_cooling_unregister(data->cool_dev); return 0; } diff --git a/include/dt-bindings/thermal/thermal.h b/include/dt-bindings/thermal/thermal.h new file mode 100644 index 0000000..59822a9 --- /dev/null +++ b/include/dt-bindings/thermal/thermal.h @@ -0,0 +1,17 @@ +/* + * This header provides constants for most thermal bindings. + * + * Copyright (C) 2013 Texas Instruments + * Eduardo Valentin <eduardo.valentin@ti.com> + * + * GPLv2 only + */ + +#ifndef _DT_BINDINGS_THERMAL_THERMAL_H +#define _DT_BINDINGS_THERMAL_THERMAL_H + +/* On cooling devices upper and lower limits */ +#define THERMAL_NO_LIMIT (-1UL) + +#endif + diff --git a/include/linux/cpu_cooling.h b/include/linux/cpu_cooling.h index a5d52ee..c303d38 100644 --- a/include/linux/cpu_cooling.h +++ b/include/linux/cpu_cooling.h @@ -24,6 +24,7 @@ #ifndef __CPU_COOLING_H__ #define __CPU_COOLING_H__ +#include <linux/of.h> #include <linux/thermal.h> #include <linux/cpumask.h> @@ -36,6 +37,24 @@ struct thermal_cooling_device * cpufreq_cooling_register(const struct cpumask *clip_cpus); /** + * of_cpufreq_cooling_register - create cpufreq cooling device based on DT. + * @np: a valid struct device_node to the cooling device device tree node. + * @clip_cpus: cpumask of cpus where the frequency constraints will happen + */ +#ifdef CONFIG_THERMAL_OF +struct thermal_cooling_device * +of_cpufreq_cooling_register(struct device_node *np, + const struct cpumask *clip_cpus); +#else +static inline struct thermal_cooling_device * +of_cpufreq_cooling_register(struct device_node *np, + const struct cpumask *clip_cpus) +{ + return NULL; +} +#endif + +/** * cpufreq_cooling_unregister - function to remove cpufreq cooling device. * @cdev: thermal cooling device pointer. */ @@ -48,6 +67,12 @@ cpufreq_cooling_register(const struct cpumask *clip_cpus) { return NULL; } +static inline struct thermal_cooling_device * +of_cpufreq_cooling_register(struct device_node *np, + const struct cpumask *clip_cpus) +{ + return NULL; +} static inline void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) { diff --git a/include/linux/thermal.h b/include/linux/thermal.h index b268d3c..f7e11c7 100644 --- a/include/linux/thermal.h +++ b/include/linux/thermal.h @@ -25,6 +25,7 @@ #ifndef __THERMAL_H__ #define __THERMAL_H__ +#include <linux/of.h> #include <linux/idr.h> #include <linux/device.h> #include <linux/workqueue.h> @@ -143,6 +144,7 @@ struct thermal_cooling_device { int id; char type[THERMAL_NAME_LENGTH]; struct device device; + struct device_node *np; void *devdata; const struct thermal_cooling_device_ops *ops; bool updated; /* true if the cooling device does not need update */ @@ -172,7 +174,7 @@ struct thermal_zone_device { int emul_temperature; int passive; unsigned int forced_passive; - const struct thermal_zone_device_ops *ops; + struct thermal_zone_device_ops *ops; const struct thermal_zone_params *tzp; struct thermal_governor *governor; struct list_head thermal_instances; @@ -242,8 +244,31 @@ struct thermal_genl_event { }; /* Function declarations */ +#ifdef CONFIG_THERMAL_OF +struct thermal_zone_device * +thermal_zone_of_sensor_register(struct device *dev, int id, + void *data, int (*get_temp)(void *, long *), + int (*get_trend)(void *, long *)); +void thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tz); +#else +static inline struct thermal_zone_device * +thermal_zone_of_sensor_register(struct device *dev, int id, + void *data, int (*get_temp)(void *, long *), + int (*get_trend)(void *, long *)) +{ + return NULL; +} + +static inline +void thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tz) +{ +} + +#endif struct thermal_zone_device *thermal_zone_device_register(const char *, int, int, - void *, const struct thermal_zone_device_ops *, + void *, struct thermal_zone_device_ops *, const struct thermal_zone_params *, int, int); void thermal_zone_device_unregister(struct thermal_zone_device *); @@ -256,6 +281,9 @@ void thermal_zone_device_update(struct thermal_zone_device *); struct thermal_cooling_device *thermal_cooling_device_register(char *, void *, const struct thermal_cooling_device_ops *); +struct thermal_cooling_device * +thermal_of_cooling_device_register(struct device_node *np, char *, void *, + const struct thermal_cooling_device_ops *); void thermal_cooling_device_unregister(struct thermal_cooling_device *); struct thermal_zone_device *thermal_zone_get_zone_by_name(const char *name); int thermal_zone_get_temp(struct thermal_zone_device *tz, unsigned long *temp); 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