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authorLen Brown <len.brown@intel.com>2012-10-09 01:35:52 -0400
committerLen Brown <len.brown@intel.com>2012-10-09 01:35:52 -0400
commit29b19e250434c6193c8b8e4c34c9c6284dd4f101 (patch)
tree8a1c8e308c9ae964f7fb612e921e10cf4c30ba15 /scripts
parent125c4c706b680c7831f0966ff873c1ad0354ec25 (diff)
parentc072fed95c9855a920c114d7fa3351f0f54ea06e (diff)
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Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts: drivers/staging/omap-thermal/omap-thermal-common. OMAP supplied dummy TC1 and TC2, at the same time that the thermal tree removed them from thermal_zone_device_register() drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c propogate the upstream MAX_IDR_LEVEL re-name to prevent a build failure Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Len Brown <len.brown@intel.com>
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