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authorhongbo.zhang <hongbo.zhang@linaro.com>2012-11-15 18:56:42 +0800
committerZhang Rui <rui.zhang@intel.com>2012-11-15 20:50:34 +0800
commitaa1acb0451bb27add173d9641d0b74c58889e693 (patch)
treee7118568c9722dc1dc69c5f19c6218be3185ab79 /drivers/thermal/Makefile
parent445110e9d05e693c5e511717a010969175878754 (diff)
downloadop-kernel-dev-aa1acb0451bb27add173d9641d0b74c58889e693.zip
op-kernel-dev-aa1acb0451bb27add173d9641d0b74c58889e693.tar.gz
Thermal: Add ST-Ericsson DB8500 thermal driver.
This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Diffstat (limited to 'drivers/thermal/Makefile')
-rw-r--r--drivers/thermal/Makefile2
1 files changed, 2 insertions, 0 deletions
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 0b6b048..d8da683 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -16,3 +16,5 @@ obj-$(CONFIG_CPU_THERMAL) += cpu_cooling.o
obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
obj-$(CONFIG_EXYNOS_THERMAL) += exynos_thermal.o
+obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
+obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o
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