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| author | Rajendra Nayak <rnayak@codeaurora.org> | 2016-05-05 14:21:39 +0530 |
|---|---|---|
| committer | Zhang Rui <rui.zhang@intel.com> | 2016-09-27 14:02:16 +0800 |
| commit | 9066073c6c27994a30187abf3b674770b4088348 (patch) | |
| tree | 56b92622d6b3386810b2a4a655b8b9ad9a9b41d9 /drivers/thermal/Makefile | |
| parent | c6935931c1894ff857616ff8549b61236a19148f (diff) | |
| download | op-kernel-dev-9066073c6c27994a30187abf3b674770b4088348.zip op-kernel-dev-9066073c6c27994a30187abf3b674770b4088348.tar.gz | |
thermal: qcom: tsens: Add a skeletal TSENS drivers
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.
Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.
Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Diffstat (limited to 'drivers/thermal/Makefile')
| -rw-r--r-- | drivers/thermal/Makefile | 1 |
1 files changed, 1 insertions, 0 deletions
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile index 10b07c1..431771e 100644 --- a/drivers/thermal/Makefile +++ b/drivers/thermal/Makefile @@ -47,6 +47,7 @@ obj-$(CONFIG_TI_SOC_THERMAL) += ti-soc-thermal/ obj-$(CONFIG_INT340X_THERMAL) += int340x_thermal/ obj-$(CONFIG_INTEL_PCH_THERMAL) += intel_pch_thermal.o obj-$(CONFIG_ST_THERMAL) += st/ +obj-$(CONFIG_QCOM_TSENS) += qcom/ obj-$(CONFIG_TEGRA_SOCTHERM) += tegra/ obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o |
