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authorEduardo Valentin <eduardo.valentin@ti.com>2012-11-14 15:23:30 +0000
committerZhang Rui <rui.zhang@intel.com>2012-11-22 15:59:52 +0800
commit4ba115b1e1ab6b717e08e0f4e766a1d16853d217 (patch)
treed8ac661046af25641101cae34b475242cd058a9a /arch/mips/power
parent3778ff5c709899a29cefe4b3077a926d0e1e9785 (diff)
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thermal: cpu cooling: allow module builds
As thermal drivers can be built as modules and also the thermal framework itself, building cpu cooling only as built-in can cause linking errors. For instance: * Generic Thermal sysfs driver * Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y with the following drive: CONFIG_OMAP_BANDGAP=m generates: ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined! This patch changes cpu cooling driver to allow it to be built as module. Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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