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authorLen Brown <len.brown@intel.com>2012-10-09 01:35:52 -0400
committerLen Brown <len.brown@intel.com>2012-10-09 01:35:52 -0400
commit29b19e250434c6193c8b8e4c34c9c6284dd4f101 (patch)
tree8a1c8e308c9ae964f7fb612e921e10cf4c30ba15 /Documentation
parent125c4c706b680c7831f0966ff873c1ad0354ec25 (diff)
parentc072fed95c9855a920c114d7fa3351f0f54ea06e (diff)
downloadop-kernel-dev-29b19e250434c6193c8b8e4c34c9c6284dd4f101.zip
op-kernel-dev-29b19e250434c6193c8b8e4c34c9c6284dd4f101.tar.gz
Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts: drivers/staging/omap-thermal/omap-thermal-common. OMAP supplied dummy TC1 and TC2, at the same time that the thermal tree removed them from thermal_zone_device_register() drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c propogate the upstream MAX_IDR_LEVEL re-name to prevent a build failure Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'Documentation')
-rw-r--r--Documentation/thermal/cpu-cooling-api.txt32
-rw-r--r--Documentation/thermal/exynos_thermal (renamed from Documentation/hwmon/exynos4_tmu)35
-rw-r--r--Documentation/thermal/sysfs-api.txt9
3 files changed, 43 insertions, 33 deletions
diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt
new file mode 100644
index 0000000..fca24c9
--- /dev/null
+++ b/Documentation/thermal/cpu-cooling-api.txt
@@ -0,0 +1,32 @@
+CPU cooling APIs How To
+===================================
+
+Written by Amit Daniel Kachhap <amit.kachhap@linaro.org>
+
+Updated: 12 May 2012
+
+Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
+
+0. Introduction
+
+The generic cpu cooling(freq clipping) provides registration/unregistration APIs
+to the caller. The binding of the cooling devices to the trip point is left for
+the user. The registration APIs returns the cooling device pointer.
+
+1. cpu cooling APIs
+
+1.1 cpufreq registration/unregistration APIs
+1.1.1 struct thermal_cooling_device *cpufreq_cooling_register(
+ struct cpumask *clip_cpus)
+
+ This interface function registers the cpufreq cooling device with the name
+ "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
+ cooling devices.
+
+ clip_cpus: cpumask of cpus where the frequency constraints will happen.
+
+1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+
+ This interface function unregisters the "thermal-cpufreq-%x" cooling device.
+
+ cdev: Cooling device pointer which has to be unregistered.
diff --git a/Documentation/hwmon/exynos4_tmu b/Documentation/thermal/exynos_thermal
index c3c6b41..2b46f67 100644
--- a/Documentation/hwmon/exynos4_tmu
+++ b/Documentation/thermal/exynos_thermal
@@ -46,36 +46,7 @@ The threshold levels are defined as follows:
The threshold and each trigger_level are set
through the corresponding registers.
-When an interrupt occurs, this driver notify user space of
-one of four threshold levels for the interrupt
-through kobject_uevent_env and sysfs_notify functions.
+When an interrupt occurs, this driver notify kernel thermal framework
+with the function exynos4_report_trigger.
Although an interrupt condition for level_0 can be set,
-it is not notified to user space through sysfs_notify function.
-
-Sysfs Interface
----------------
-name name of the temperature sensor
- RO
-
-temp1_input temperature
- RO
-
-temp1_max temperature for level_1 interrupt
- RO
-
-temp1_crit temperature for level_2 interrupt
- RO
-
-temp1_emergency temperature for level_3 interrupt
- RO
-
-temp1_max_alarm alarm for level_1 interrupt
- RO
-
-temp1_crit_alarm
- alarm for level_2 interrupt
- RO
-
-temp1_emergency_alarm
- alarm for level_3 interrupt
- RO
+it can be used to synchronize the cooling action.
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt
index c087dbc..ca1a1a3 100644
--- a/Documentation/thermal/sysfs-api.txt
+++ b/Documentation/thermal/sysfs-api.txt
@@ -84,7 +84,8 @@ temperature) and throttle appropriate devices.
1.3 interface for binding a thermal zone device with a thermal cooling device
1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
- int trip, struct thermal_cooling_device *cdev);
+ int trip, struct thermal_cooling_device *cdev,
+ unsigned long upper, unsigned long lower);
This interface function bind a thermal cooling device to the certain trip
point of a thermal zone device.
@@ -93,6 +94,12 @@ temperature) and throttle appropriate devices.
cdev: thermal cooling device
trip: indicates which trip point the cooling devices is associated with
in this thermal zone.
+ upper:the Maximum cooling state for this trip point.
+ THERMAL_NO_LIMIT means no upper limit,
+ and the cooling device can be in max_state.
+ lower:the Minimum cooling state can be used for this trip point.
+ THERMAL_NO_LIMIT means no lower limit,
+ and the cooling device can be in cooling state 0.
1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev);
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