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authorLinus Torvalds <torvalds@linux-foundation.org>2013-09-12 07:42:59 -0700
committerLinus Torvalds <torvalds@linux-foundation.org>2013-09-12 07:42:59 -0700
commitb9b42eeb88d36cc7400925302f1587aaaa348905 (patch)
treef5260ad8013adeca9f86c85c096099844238c725 /Documentation
parent7b7a2f0a31c6c1ff53a3c87c0bca4f8d01471391 (diff)
parent50e66c7ed8a1cd7e933628f9f5cf2617394adf5a (diff)
downloadop-kernel-dev-b9b42eeb88d36cc7400925302f1587aaaa348905.zip
op-kernel-dev-b9b42eeb88d36cc7400925302f1587aaaa348905.tar.gz
Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui: "We have a lot of SOC changes and a few thermal core fixes this time. The biggest change is about exynos thermal driver restructure. The patch set adds TMU (Thermal management Unit) driver support for exynos5440 platform. There are 3 instances of the TMU controllers so necessary cleanup/re-structure is done to handle multiple thermal zone. The next biggest change is the introduction of the imx thermal driver. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Highlights: - restructure exynos thermal driver. - introduce new imx thermal driver. - fix a bug in thermal core, which powers on the fans unexpectedly after resume from suspend" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (46 commits) drivers: thermal: add check when unregistering cpu cooling thermal: thermal_core: allow binding with limits on bind_params drivers: thermal: make usage of CONFIG_THERMAL_HWMON optional drivers: thermal: parent virtual hwmon with thermal zone thermal: hwmon: move hwmon support to single file thermal: exynos: Clean up non-DT remnants thermal: exynos: Fix potential NULL pointer dereference thermal: exynos: Fix typos in Kconfig thermal: ti-soc-thermal: Ensure to compute thermal trend thermal: ti-soc-thermal: Set the bandgap mask counter delay value thermal: ti-soc-thermal: Initialize counter_delay field for TI DRA752 sensors thermal: step_wise: return instance->target by default thermal: step_wise: cdev only needs update on a new target state Thermal/cpu_cooling: Return directly for the cpu out of allowed_cpus in the cpufreq_thermal_notifier() thermal: exynos_tmu: fix wrong error check for mapped memory thermal: imx: implement thermal alarm interrupt handling thermal: imx: dynamic passive and SoC specific critical trip points Documentation: thermal: Explain the exynos thermal driver model ARM: dts: thermal: exynos: Add documentation for Exynos SoC thermal bindings thermal: exynos: Support for TMU regulator defined at device tree ...
Diffstat (limited to 'Documentation')
-rw-r--r--Documentation/devicetree/bindings/thermal/exynos-thermal.txt55
-rw-r--r--Documentation/devicetree/bindings/thermal/imx-thermal.txt17
-rw-r--r--Documentation/thermal/exynos_thermal43
-rw-r--r--Documentation/thermal/sysfs-api.txt12
4 files changed, 118 insertions, 9 deletions
diff --git a/Documentation/devicetree/bindings/thermal/exynos-thermal.txt b/Documentation/devicetree/bindings/thermal/exynos-thermal.txt
new file mode 100644
index 0000000..284f530
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/exynos-thermal.txt
@@ -0,0 +1,55 @@
+* Exynos Thermal Management Unit (TMU)
+
+** Required properties:
+
+- compatible : One of the following:
+ "samsung,exynos4412-tmu"
+ "samsung,exynos4210-tmu"
+ "samsung,exynos5250-tmu"
+ "samsung,exynos5440-tmu"
+- interrupt-parent : The phandle for the interrupt controller
+- reg : Address range of the thermal registers. For soc's which has multiple
+ instances of TMU and some registers are shared across all TMU's like
+ interrupt related then 2 set of register has to supplied. First set
+ belongs to each instance of TMU and second set belongs to common TMU
+ registers.
+- interrupts : Should contain interrupt for thermal system
+- clocks : The main clock for TMU device
+- clock-names : Thermal system clock name
+- vtmu-supply: This entry is optional and provides the regulator node supplying
+ voltage to TMU. If needed this entry can be placed inside
+ board/platform specific dts file.
+
+Example 1):
+
+ tmu@100C0000 {
+ compatible = "samsung,exynos4412-tmu";
+ interrupt-parent = <&combiner>;
+ reg = <0x100C0000 0x100>;
+ interrupts = <2 4>;
+ clocks = <&clock 383>;
+ clock-names = "tmu_apbif";
+ status = "disabled";
+ vtmu-supply = <&tmu_regulator_node>;
+ };
+
+Example 2):
+
+ tmuctrl_0: tmuctrl@160118 {
+ compatible = "samsung,exynos5440-tmu";
+ reg = <0x160118 0x230>, <0x160368 0x10>;
+ interrupts = <0 58 0>;
+ clocks = <&clock 21>;
+ clock-names = "tmu_apbif";
+ };
+
+Note: For multi-instance tmu each instance should have an alias correctly
+numbered in "aliases" node.
+
+Example:
+
+aliases {
+ tmuctrl0 = &tmuctrl_0;
+ tmuctrl1 = &tmuctrl_1;
+ tmuctrl2 = &tmuctrl_2;
+};
diff --git a/Documentation/devicetree/bindings/thermal/imx-thermal.txt b/Documentation/devicetree/bindings/thermal/imx-thermal.txt
new file mode 100644
index 0000000..541c25e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/imx-thermal.txt
@@ -0,0 +1,17 @@
+* Temperature Monitor (TEMPMON) on Freescale i.MX SoCs
+
+Required properties:
+- compatible : "fsl,imx6q-thermal"
+- fsl,tempmon : phandle pointer to system controller that contains TEMPMON
+ control registers, e.g. ANATOP on imx6q.
+- fsl,tempmon-data : phandle pointer to fuse controller that contains TEMPMON
+ calibration data, e.g. OCOTP on imx6q. The details about calibration data
+ can be found in SoC Reference Manual.
+
+Example:
+
+tempmon {
+ compatible = "fsl,imx6q-tempmon";
+ fsl,tempmon = <&anatop>;
+ fsl,tempmon-data = <&ocotp>;
+};
diff --git a/Documentation/thermal/exynos_thermal b/Documentation/thermal/exynos_thermal
index 2b46f67..9010c44 100644
--- a/Documentation/thermal/exynos_thermal
+++ b/Documentation/thermal/exynos_thermal
@@ -1,17 +1,17 @@
-Kernel driver exynos4_tmu
+Kernel driver exynos_tmu
=================
Supported chips:
-* ARM SAMSUNG EXYNOS4 series of SoC
- Prefix: 'exynos4-tmu'
+* ARM SAMSUNG EXYNOS4, EXYNOS5 series of SoC
Datasheet: Not publicly available
Authors: Donggeun Kim <dg77.kim@samsung.com>
+Authors: Amit Daniel <amit.daniel@samsung.com>
-Description
------------
+TMU controller Description:
+---------------------------
-This driver allows to read temperature inside SAMSUNG EXYNOS4 series of SoC.
+This driver allows to read temperature inside SAMSUNG EXYNOS4/5 series of SoC.
The chip only exposes the measured 8-bit temperature code value
through a register.
@@ -34,9 +34,9 @@ The three equations are:
TI2: Trimming info for 85 degree Celsius (stored at TRIMINFO register)
Temperature code measured at 85 degree Celsius which is unchanged
-TMU(Thermal Management Unit) in EXYNOS4 generates interrupt
+TMU(Thermal Management Unit) in EXYNOS4/5 generates interrupt
when temperature exceeds pre-defined levels.
-The maximum number of configurable threshold is four.
+The maximum number of configurable threshold is five.
The threshold levels are defined as follows:
Level_0: current temperature > trigger_level_0 + threshold
Level_1: current temperature > trigger_level_1 + threshold
@@ -47,6 +47,31 @@ The threshold levels are defined as follows:
through the corresponding registers.
When an interrupt occurs, this driver notify kernel thermal framework
-with the function exynos4_report_trigger.
+with the function exynos_report_trigger.
Although an interrupt condition for level_0 can be set,
it can be used to synchronize the cooling action.
+
+TMU driver description:
+-----------------------
+
+The exynos thermal driver is structured as,
+
+ Kernel Core thermal framework
+ (thermal_core.c, step_wise.c, cpu_cooling.c)
+ ^
+ |
+ |
+TMU configuration data -------> TMU Driver <------> Exynos Core thermal wrapper
+(exynos_tmu_data.c) (exynos_tmu.c) (exynos_thermal_common.c)
+(exynos_tmu_data.h) (exynos_tmu.h) (exynos_thermal_common.h)
+
+a) TMU configuration data: This consist of TMU register offsets/bitfields
+ described through structure exynos_tmu_registers. Also several
+ other platform data (struct exynos_tmu_platform_data) members
+ are used to configure the TMU.
+b) TMU driver: This component initialises the TMU controller and sets different
+ thresholds. It invokes core thermal implementation with the call
+ exynos_report_trigger.
+c) Exynos Core thermal wrapper: This provides 3 wrapper function to use the
+ Kernel core thermal framework. They are exynos_unregister_thermal,
+ exynos_register_thermal and exynos_report_trigger.
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt
index a71bd5b..87519cb 100644
--- a/Documentation/thermal/sysfs-api.txt
+++ b/Documentation/thermal/sysfs-api.txt
@@ -134,6 +134,13 @@ temperature) and throttle appropriate devices.
this thermal zone and cdev, for a particular trip point.
If nth bit is set, then the cdev and thermal zone are bound
for trip point n.
+ .limits: This is an array of cooling state limits. Must have exactly
+ 2 * thermal_zone.number_of_trip_points. It is an array consisting
+ of tuples <lower-state upper-state> of state limits. Each trip
+ will be associated with one state limit tuple when binding.
+ A NULL pointer means <THERMAL_NO_LIMITS THERMAL_NO_LIMITS>
+ on all trips. These limits are used when binding a cdev to a
+ trip point.
.match: This call back returns success(0) if the 'tz and cdev' need to
be bound, as per platform data.
1.4.2 struct thermal_zone_params
@@ -142,6 +149,11 @@ temperature) and throttle appropriate devices.
This is an optional feature where some platforms can choose not to
provide this data.
.governor_name: Name of the thermal governor used for this zone
+ .no_hwmon: a boolean to indicate if the thermal to hwmon sysfs interface
+ is required. when no_hwmon == false, a hwmon sysfs interface
+ will be created. when no_hwmon == true, nothing will be done.
+ In case the thermal_zone_params is NULL, the hwmon interface
+ will be created (for backward compatibility).
.num_tbps: Number of thermal_bind_params entries for this zone
.tbp: thermal_bind_params entries
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