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authorZhang Rui <rui.zhang@intel.com>2012-06-27 10:09:36 +0800
committerZhang Rui <rui.zhang@intel.com>2012-09-24 14:44:37 +0800
commitcddf31b3b293fd20358ea506f22445611425811f (patch)
tree0593121354b57e6781b480c117292107259b5b3f /COPYING
parent2d374139d5b0b596cfbd892bf3ec7dacb3049904 (diff)
downloadop-kernel-dev-cddf31b3b293fd20358ea506f22445611425811f.zip
op-kernel-dev-cddf31b3b293fd20358ea506f22445611425811f.tar.gz
Thermal: Rename thermal_instance.node to thermal_instance.tz_node.
thermal_instance should be referenced by both thermal zone devices and thermal cooling devices. Rename thermal_instance.node to thermal_instance.tz_node in this patch and thermal_instanace.cdev_node will be introduced in next patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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