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+/**
+
+Copyright (C) 2013, Intel Corporation
+
+Redistribution and use in source and binary forms, with or without modification,
+are permitted provided that the following conditions are met:
+
+* Redistributions of source code must retain the above copyright notice, this
+ list of conditions and the following disclaimer.
+* Redistributions in binary form must reproduce the above copyright notice, this
+ list of conditions and the following disclaimer in the documentation and/or
+ other materials provided with the distribution.
+* Neither the name of Intel Corporation nor the names of its contributors may
+ be used to endorse or promote products derived from this software without
+ specific prior written permission.
+
+ THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS"
+ AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE
+ IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
+ ARE DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT OWNER OR CONTRIBUTORS BE
+ LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR
+ CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF
+ SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS
+ INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN
+ CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE)
+ ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE, EVEN IF ADVISED OF
+ THE POSSIBILITY OF SUCH DAMAGE.
+
+**/
+
+#ifndef _FSP_PLATFORM_H_
+#define _FSP_PLATFORM_H_
+
+#include "fsptypes.h"
+#include "fspapi.h"
+
+//
+// Maximum number of SDRAM channels supported by each CPU
+//
+#define MAX_CHANNELS 2
+//
+// Maximum number of DIMM sockets supported by each channel
+//
+#define MAX_DIMMS 2
+
+#pragma pack(1)
+//
+// SPD DDR3 structure
+//
+typedef struct {
+ UINT8 DRAMDeviceType; // 2 DRAM Device Type
+ UINT8 ModuleType; // 3 Module Type
+ UINT8 SDRAMDensityAndBanks; // 4 SDRAM Density and Banks
+ UINT8 SDRAMAddressing; // 5 SDRAM Addressing
+ UINT8 VDD; // 6 Module Nominal Voltage
+ UINT8 ModuleOrganization; // 7 Module Organization
+ UINT8 ModuleMemoryBusWidth; // 8 Module Memory Bus Width
+ UINT8 TimebaseDividend; // 10 Medium Timebase (MTB) Dividend
+ UINT8 TimebaseDivisor; // 11 Medium Timebase (MTB) Divisor
+ UINT8 SDRAMMinimumCycleTime; // 12 SDRAM Minimum Cycle Time (tCKmin)
+ UINT8 CASLatenciesLSB; // 14 CAS Latencies Supported, Least Significant Byte
+ UINT8 CASLatenciesMSB; // 15 CAS Latencies Supported, Most Significant Byte
+ UINT8 MinimumCASLatencyTime; // 16 Minimum CAS Latency Time (tAAmin)
+ UINT8 MinimumWriteRecoveryTime; // 17 Minimum Write Recovery Time (tWRmin)
+ UINT8 MinimumRASToCASDelayTime; // 18 Minimum RAS# to CAS# Delay Time (tRCDmin)
+ UINT8 MinimumRowToRowDelayTime; // 19 Minimum Row Active to Row Active Delay Time (tRRDmin)
+ UINT8 MinimumRowPrechargeDelayTime; // 20 Minimum Row Precharge Delay Time (tRPmin)
+ UINT8 UpperNibblesFortRASAndtRC; // 21 Upper Nibbles for tRAS and tRC
+ UINT8 tRASmin; // 22 Minimum Active to Precharge Delay Time (tRASmin), Least Significant Byte
+ UINT8 tRCmin; // 23 Minimum Active to Active/Refresh Delay Time (tRCmin), Least Significant Byte
+ UINT8 tRFCminLeastSignificantByte; // 24 Minimum Refresh Recovery Delay Time (tRFCmin), Least Significant Byte
+ UINT8 tRFCminMostSignificantByte; // 25 Minimum Refresh Recovery Delay Time (tRFCmin), Most Significant Byte
+ UINT8 tWTRmin; // 26 Minimum Internal Write to Read Command Delay Time (tWTRmin)
+ UINT8 tRTPmin; // 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin)
+ UINT8 UpperNibbleFortFAW; // 28 Upper Nibble for tFAW
+ UINT8 tFAWmin; // 29 Minimum Four Activate Window Delay Time (tFAWmin)
+ UINT8 ModuleThermalSensor; // 32 ModuleThermalSensor
+ UINT8 SDRAMDeviceType; // 33 SDRAM Device Type
+ UINT8 tCKminFine; // 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin)
+ UINT8 tAAminFine; // 35 Fine Offset for Minimum CAS Latency Time (tAAmin)
+ UINT8 MACCount; // 41 Maximum Activate Count
+ UINT8 ReferenceRawCardUsed; // 62 Reference Raw Card Used
+ UINT8 AddressMappingEdgeConnector; // 63 Address Mapping from Edge Connector to DRAM
+ UINT8 ModuleManufacturerIdCodeLsb; // 117 Module Manufacturer ID Code, Least Significant Byte
+ UINT8 ModuleManufacturerIdCodeMsb; // 118 Module Manufacturer ID Code, Most Significant Byte
+ UINT8 ModuleManufacturingLocation; // 119 Module Manufacturing Location
+ UINT8 ModuleManufacturingDateYear; // 120 Module Manufacturing Date Year
+ UINT8 ModuleManufacturingDateWW; // 121 Module Manufacturing Date creation work week
+ UINT8 ModuleSerialNumberA; // 122 Module Serial Number A
+ UINT8 ModuleSerialNumberB; // 123 Module Serial Number B
+ UINT8 ModuleSerialNumberC; // 124 Module Serial Number C
+ UINT8 ModuleSerialNumberD; // 125 Module Serial Number D
+ UINT8 DramManufacturerIdLsb; // 148 DRAM Manufacturer ID Code, LSB
+ UINT8 DramManufacturerIdMsb; // 149 DRAM Manufacturer ID Code, MSB
+} MEM_DOWN_DIMM_SPD_DATA;
+
+typedef struct {
+ UINT32 MemoryDownDimmPopulation; // 0 - Empty, 1 - DIMM populated
+ MEM_DOWN_DIMM_SPD_DATA MemoryDownDimmSpdData;
+} MEM_DOWN_DIMM_CONFIG;
+
+typedef struct {
+ CONST MEM_DOWN_DIMM_CONFIG *MemDownDimmConfig[MAX_CHANNELS][MAX_DIMMS];
+} FSP_INIT_RT_PLATFORM_BUFFER;
+
+typedef struct {
+ FSP_INIT_RT_COMMON_BUFFER Common;
+ FSP_INIT_RT_PLATFORM_BUFFER Platform;
+} FSP_INIT_RT_BUFFER;
+
+#pragma pack()
+
+#endif \ No newline at end of file
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